Electroless nickel plating on polymer particles

Fujii, Syuji; Hamasaki, Hiroyuki; Takeoka, Hiroaki; Tsuruoka, Takaaki; Akamatsu, Kensuke; Nakamura, Yoshinobu

doi:10.1016/j.jcis.2014.05.041

Cited by 26 publications

(12 citation statements)

References 19 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The shear deposition rate in the case of the nickel plating containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that observed when the plating contained only one of the three additives. The plating deposition rate is higher than previously published or patented values [4]. According to the results of shear testing, the shear deposition rates observed for the plating baths containing only 2-mercaptobenzimidazole, thioglycolic acid, or 2mercaptobenzothiazole are 70 m, 80 m, and 95 m, respectively.…”

Section: Resultsmentioning

confidence: 53%

“…Liu et al contributed to industrial development by studying the recovery of high-purity ferric phosphate [3]. In another work, Fujii et al achieved electroless nickel plating on 2 Journal of Chemistry polymer particles [4]. Rajaguru et al contributed importantly to the metal plating industry by performing electroless nickel plating for low-volume production of plastic parts [5].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

Gezerman

Çorbacıoğlu

2015

Journal of Chemistry

View full text Add to dashboard Cite

The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.

show abstract

Section: Resultsmentioning

confidence: 53%

Section: Introductionmentioning

confidence: 99%

2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

Gezerman

Çorbacıoğlu

2015

Journal of Chemistry

View full text Add to dashboard Cite

show abstract

“…electroplating where an applied current is needed to reduce a high-oxidation-state metal precursor, the basis of electrolessplating is an autocatalytic redox reaction 17) . In the case of electroplating, thickness of deposited layer is not uniform because distribution of current density is not uniform dependent upon voltage reaction 18) .…”

Section: Resultsmentioning

confidence: 99%

Fabrication of Core-Shell Structure of Ni/Au Layer on PMMA Micro-Ball for Flexible Electronics

Song¹,

Jeong²,

Han³

2016

Current Photovoltaic Research

View full text Add to dashboard Cite

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was 2.8 μ m within ±7% deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of 130°C while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about 6.0 Ω. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

show abstract

“…Many literatures about modified wood have also been conducted [11][12][13][14]. It is well known that electroless is a method to deposition metals such as Ni and Cu onto an insulating substrate through the catalyzed chemical reduction of solution-phase metal ions at the substrate surface [15]. Ni, Cu, and Ni-based alloy coatings have been deposited onto wood surface to prepare electromagnetic shielding materials [16][17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Multilayer-Structured Wood Electroless Cu–Ni Composite Coatings for Electromagnetic Interference Shielding

Pan

Yin

et al. 2020

Coatings

View full text Add to dashboard Cite

The lightweight multilayer-structured electromagnetic interference shielding composite coatings with controllable electromagnetic gradient on wood surface were prepared via a simple multiple electroless copper–nickel (Cu–Ni) approach. The surface morphology, conductivity, hydrophobicity property and electromagnetic shielding effectiveness of the composite coatings were investigated. The surface roughness and conductivity of the composite coatings were enhanced with the increase in the number of depositions. The surface morphology demonstrated that the roughness was decreased with the process of multiple electroless. The coatings were compact and homogeneous as the deposition run was three. Here, the Sa (Sa illustrated Surface Roughness) value of coatings was 4.497 μm. The ideal conductivity of composite coatings can be obtained as the number of depositions was four. Electromagnetic shielding effectiveness reached average 90.69 dB in the frequency range from 300 kHz to 2.0 GHz. This study provides a new pathway for fabricating lightweight multilayer-structured electromagnetic interference shielding with controllable electromagnetic gradient and hydrophobic composite coatings-based wood.

show abstract

Electroless nickel plating on polymer particles

Cited by 26 publications

References 19 publications

2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

Fabrication of Core-Shell Structure of Ni/Au Layer on PMMA Micro-Ball for Flexible Electronics

Multilayer-Structured Wood Electroless Cu–Ni Composite Coatings for Electromagnetic Interference Shielding

Contact Info

Product

Resources

About