Electroless Silver Coating on Copper Microcones for Low-Temperature Solid-State Bonding

Hu, Fengtian; Yang, Shao; Wang, Haozhe; Hu, Anmin; Li, Ming

doi:10.1007/s11664-015-3930-2

Cited by 13 publications

(1 citation statement)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Three diffraction peaks displayed at 43.0°« 0.1°, 50.1°« 0.1°and 73.9°« 0.1 correspond to crystal planes of Cu (111), (200) and (220). The results were very close to the powder diffraction standards (PDF card number 040836: 43.297°; 50.433°; 74.140°), 28 which represented a face-centered cubic lattice structure. According to the intensity percents (R) of diffraction peak for each crystal plane in Fig.…”

Section: Bath Stabilitysupporting

confidence: 75%

Evaluation of K3Fe(CN)6 on Deposition Behavior and Structure of Electroless Copper Plating

Wang

Deng

et al. 2019

Electrochemistry

View full text Add to dashboard Cite

Potassium ferricyanide (K 3 Fe(CN) 6) as a stabilizer was used for electroless copper plating in EDTA/THPED dualligands system. The deposition behavior and surface structure of copper layer were studied systematically. The results indicated that the overall deposition process was divided into three regions designated as induction, transitional and stable regions. It was confirmed that K 3 Fe(CN) 6 can delay the fall-off trend of electrode potential, which may be related to the competitive adsorption between Fe(CN) 6 3− with large radius and OH − with small radius on the electrode surface. The addition of K 3 Fe(CN) 6 led to a decrease of 70% in redox current density, which reduced obviously Cu deposition rate. Meanwhile, the decomposition time of electroless solution sharply increased and the reoxidation of Cu(I) ion was effectively inhibited in the presence of K 3 Fe(CN) 6. Metallographic studies of copper layers with and without K 3 Fe(CN) 6 stabilizer revealed that surface structures and fine particle distribution were uniform. The resultant product was high-purity without detectable iron impurities. Moreover, the addition of K 3 Fe(CN) 6 was favorable to the formation of the preferred orientation on (220) crystal plane, and the grain size decreased from 61.5 nm to 40.4 nm with the addition of 50 mg L −1 K 3 Fe(CN) 6 .

show abstract

Section: Bath Stabilitysupporting

confidence: 75%