Electroless Sn–Ni alloy plating with high Sn content free of activation pretreatment

Kong, Yong; Shao, Jianqun; Wang, Wenchang; Liu, Qifa; Chen, Zhidong

doi:10.1016/j.jallcom.2008.09.074

Cited by 21 publications

(12 citation statements)

References 16 publications

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“…[22][23][24][25] However, the effective Ni-activation method for Cu substrate has not been successfully developed. Among the methods of surface modification of Cu, the replacement deposition of Sn-Ni alloy 26 and Sn [27][28][29] using thiourea as the complex for Cu may provide a feasible approach for Ni-activation. 30,31 The electrode potential of Cu can shift to negative direction in high concentration solution of thiourea due to the active dissolution of Cu.…”

mentioning

confidence: 99%

Replacement Deposition of Ni-S Films on Cu and Their Catalytic Activity for Electroless Nickel Plating

Tian

Xiao

et al. 2013

J. Electrochem. Soc.

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Highnic GroupA Ni-S film was prepared on Cu substrate via the replacement reaction due to the quite negative electrode potential of Cu in high concentrated thiourea solution. A lower pH environment was facilitated to form more uniform Ni-S film. The sulfur content in the Ni-S film increased with the increase of deposition time and the rise of pH in solution. Relative to pure Ni, the existence of sulfur in the Ni-S film was found to result in different electrochemical properties. More importantly, constant current discharge curve and anodic polarization curve measurements indicated that the Ni-S film with higher sulfur content was more prone to be passivated, with negative influences on its catalytic activity. Polarization curve, electrochemical impedance spectroscopy and open circuit potential measurements were employed to investigate the catalytic activity of the Ni-S film for hypophosphite oxidation and electroless nickel (EN) plating. With the optimization of sulfur content by plating conditions, we could significantly improve the catalytic activity of the Ni-S film for hypophosphite oxidation and consequently for EN plating. Compared with the traditional Pd film, the Ni-S film exhibited a comparable catalytic activity, with a uniform electroless Ni-P layer obtained during the EN plating. (C) 2013 The Electrochemical Society. [DOI: 10.1149/2.034303jes] All rights reserved

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mentioning

confidence: 99%

Replacement Deposition of Ni-S Films on Cu and Their Catalytic Activity for Electroless Nickel Plating

Tian

Xiao

et al. 2013

J. Electrochem. Soc.

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“…The micropatterned Sn/Cu films were found to be effective to some extent, however, insufficient for the practical stress relaxation. Further improvement of the cycle performance could be achieved, for example, by exploiting microscopic stress relaxation using alloys such as Sn-Ni, 10,11,20 macroporous patterns formed with a polystyrene template 21,22 as well as the enhanced adhesiveness of active materials. 23 Obviously, one should keep the fact in mind that any effort to reduce the volume change of Sn during lithiation and delithiation by forming alloys and patterns would reduce the theoretical capacity in return for a good cycle performance.…”

Section: Methodsmentioning

confidence: 99%

“…990 mAh g −1 ) and high electromotive forces. [8][9][10][11][12] The capacity of the carbonaceous materials currently used, in Li-ion batteries is approaching the theoretical limit of 372 mAh g −1 , thus alternative materials are required for further improvements in capacity. However, Ichitsubo et al have quantitatively shown that the elastic-strain energy accompanying the volume change during lithiation and delithiation of Sn-based negative electrodes causes a negative shift of the electrode potential and significant degradation of the electrode.…”

mentioning

confidence: 99%

Two-Dimensionally Patterned Electrodeposition of Sn Film from Aqueous Acid Bath

Yagi

Takeda

Okada

et al. 2012

ECS Electrochemistry Letters

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The electrodeposition of two-dimensional Sn micropatterns without whisker growth was investigated using an aqueous acid bath. Polyethylene glycol suppressed the growth of Sn normal to the surface of a Cu foil substrate and flat Sn micropatterns were successfully obtained on various different photoresist-patterned Cu foils. The current efficiency of Sn electrodeposition was higher than 97% for all samples, although the pH of the solution was about 0.0, indicating that the overpotential of H 2 evolution on the Sn/Cu substrate was quite large. Sn micropatterns, in the form of both lines and circles, showed a slight macroscopic stress relaxation effect.Through the ages, Sn has been widely used as soldering, bearing alloy, and coating materials because of its low toxicity and low melting temperature of about 232 • C. 1-7 Sn and its alloys have also attracted attention as negative electrode materials for Li batteries with high theoretical capacities (e.g., Li 22 Sn 5 , ca. 990 mAh g −1 ) and high electromotive forces. [8][9][10][11][12] The capacity of the carbonaceous materials currently used, in Li-ion batteries is approaching the theoretical limit of 372 mAh g −1 , thus alternative materials are required for further improvements in capacity. However, Ichitsubo et al. have quantitatively shown that the elastic-strain energy accompanying the volume change during lithiation and delithiation of Sn-based negative electrodes causes a negative shift of the electrode potential and significant degradation of the electrode. 13-15 Moreover, highly concentrated Sn tends to form whiskers, which can cause short-circuiting. 16,17 In the present work, we demonstrate the electrodeposition of twodimensional Sn micropatterns on Cu foils from an aqueous acid bath utilizing a photolithographic technique. The effect of polyethylene glycol on the surface morphology of Sn and the potential change during electrodeposition were also investigated. This work provides general guidelines for the patterned electrodeposition of other types of metals or alloys. Furthermore, we evaluated the stress relaxation effect during lithiation and delithiation using two-dimensional Sn micropatterns as a reference.

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“…Their results showed that the capacity falls as the increasing thickness . Other nonstoichiometric Ni‐Sn alloys, such as Sn 62 Ni 38 , 60 wt.% of Sn content of the Sn‐Ni layer, and nanostructured Ni 3.5 Sn 4 intermetallic compound, have been widely prepared for using as anode materials for high‐capacity LIBs.…”

Section: Structures Lithiation Mechanism and Electrochemical Performentioning

confidence: 99%

Sn‐based Intermetallic Compounds for Li‐ion Batteries: Structures, Lithiation Mechanism, and Electrochemical Performances

Wang

Cheng

et al. 2018

Energy & Environ Materials

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On account of the lower theoretical capacity of the traditional graphite, the development of reliable anode materials with high capacity and energy density for application in lithium‐ion batteries (LIBs) is zealously pursued to meet the ever‐increasing power demands for portable mobile devices or (hybrid) electronic vehicles. Recently, Sn‐based intermetallic compounds have attracted considerable research interests as the promising candidate anode materials for high‐performance LIBs in consideration of the high theoretical capacity of Sn (994 mAh g−1) and low operating voltage (below 0.6 V vs Li+/Li). The fabrication of Sn‐based intermetallic compounds is aiming at buffering the huge volumetric variation of Sn anode during lithiation/delithiation processes. Therefore, the rational construction of those anode materials with enhanced electrochemical performance is meaningful. This review is focusing on sum up the recent development in the structures, lithiation mechanism and electrochemical performances of various Sn‐based intermetallic compounds as anode materials in LIBs. The developments of modified methods for further enhancement of lithium storage performances of Sn‐based intermetallic compounds are also systematically summarized. We hope this review could provide a fundamental understanding of the Sn‐based intermetallic compounds for the application in LIBs.

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Electroless Sn–Ni alloy plating with high Sn content free of activation pretreatment

Cited by 21 publications

References 16 publications

Replacement Deposition of Ni-S Films on Cu and Their Catalytic Activity for Electroless Nickel Plating

Replacement Deposition of Ni-S Films on Cu and Their Catalytic Activity for Electroless Nickel Plating

Two-Dimensionally Patterned Electrodeposition of Sn Film from Aqueous Acid Bath

Sn‐based Intermetallic Compounds for Li‐ion Batteries: Structures, Lithiation Mechanism, and Electrochemical Performances

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