Electrolytic models for metallic electromigration failure mechanisms

Krumbein, S.

doi:10.1109/24.475971

Cited by 37 publications

(17 citation statements)

References 28 publications

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“…Therefore, ECM is totally different from solidstate electro-migration which is the mass transport of metal under dry conditions due to the momentum transfer between conducting electrons and diffusing metal atoms. 3 This process is also different from the whisker growth which is induced by compressive mechanical stress in electronics.…”

Section: Ecm Ismentioning

confidence: 99%

“…3,64,69,71,148 This is because higher voltage enhances the dissolution of metal at anode and the reduction of metal ions at cathode, at the same time, accelerates migration speed of ions, resulting in rapid dendrite growth. 64 However, some specic points need to be paid attention as well.…”

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confidence: 99%

“…The addition of Ag into Sn matrix can form a chemical stable intermetallic compound Ag 3 Sn, in which Ag is difficult to escape during the ECM, resulting in that Ag migration is prevented. Therefore, it is generally considered that the migration characteristics of Sn-Ag solder alloys are still related to the dissolution characteristics of Sn, 27,65,71,132 although that pure Ag is one of the most susceptible metals to ECM.…”

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confidence: 99%

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Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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Section: Ecm Ismentioning

confidence: 99%

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confidence: 99%

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confidence: 99%

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Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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“…Although Brunauer et al [9] found an exponential increase in surface conductivity, not all metals that are susceptible to ECM have been found to migrate under humid conditions. Silver and, to some extent, copper have been reported to migrate under humid conditions [10]- [15], while other susceptible metals usually require a visible water layer (condensed conditions) [8], [16]- [26]. However, as distances on the PCBs are getting smaller due to miniaturization, the risk of having a condensation nucleus expanding over two conductors increases, and the relevance for ECM under wet (condensed) conditions is therefore increasing.…”

mentioning

confidence: 99%

“…ECM has traditionally been roughly divided into two subcategories: humid ECM, where a thin invisible moisture film is adsorbed to the surface, and condensed ECM, where a visible layer of condensed water is present [8]. Although Brunauer et al [9] found an exponential increase in surface conductivity, not all metals that are susceptible to ECM have been found to migrate under humid conditions.…”

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confidence: 99%

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Minzari

Jellesen

Møller

et al. 2009

IEEE Trans. Device Mater. Relib.

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Abstract-Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb alloy. Anodic polarization behavior of the electrode materials was investigated using a microelectrochemical setup. Material makeup of the chip resistor was investigated using scanning electron microscopy (SEM)/energy dispersive spectroscopy and focused-ion-beam SEM. Results showed that the dissolution rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential.

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Accelerated testing and failure of thin‐film PV modules

McMahon

2004

Progress in Photovoltaics

119

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Packaging-related PV module failure is distinguished from cell failure, and those failures specific to thin-film modules are reviewed. These are categorized according to the type of stress that produced them, e.g., temperature, voltage, moisture, current, and thermal cycling. An example is given that shows how to relate time under accelerated stress to time in use. Diagnostic tools for locating the affected area within a large-area module are pointed out along with the importance of interpretation of the visual appearance of the different damage mechanisms. INTRODUCTIONT he U.S. Department of Energy encourages and supports the photovoltaic (PV) industry in developing a module technology that will last 30 years in the field. 1 An additional goal is to identify a short-term means to certify that a module technology will, indeed, last 30 years. The achievement of the first goal for thin-film (TF) PV modules will be more difficult than for the single-and multi-crystalline Si modules that have been available for some time. There are at least four reasons for this: (1) TF cells have a lower threshold for corrosion and delamination; (2) several of the amorphous Si and CdTe TF technologies use the SnO 2 -coated soda-lime glass superstrate configuration requiring an edge-deleted module perimeter; (3) SnO 2 -coated glass under high cell-to-frame voltage conditions and humidity can cause delamination of the SnO 2 /glass interface; and (4) TF module configurations usually lack the extra isolation that is afforded by extra layers of laminating material (EVA or thermoplastic) found in non-TF modules.Regarding the second goal, arguments have been made that achievement of a test protocol to certify a 30-year lifetime is not possible. 2 Short of such a 30-year lifetime certification process, an approach for rank ordering and testing of failure modes has been developed; R. G. Ross 3 has put forth another method that rank orders mechanisms according to analysis of the 'life-cycle energy cost impact'. Rank ordering allows the PV industry to address the more pressing problems first, without the encumbrance of complicated lifetime-prediction methdologies. Recently, M. A. Quintana et al. have reported commonly observed degradation in field-aged PV modules. 4 The visual appearance of many failure mechanisms related to packaging can be very striking. Any one of the TF layers can be damaged from corrosion, electrolytic electromigration, diffusion, cracking, and delamination. Especially notable are the effects of glass corrosion. Each of the failure mechanisms that results in visual damage has its own appearance. Considerable progress can be made in understanding module-packaging failure if proper interpretation of the visual damage is provied by an astute observer. The following is a review of failure mechanisms and strategies special to the certification and analysis of TF module reliability. Much of this work was carried out at the Jet Propulsion Laboratory (JPL) in the 1980s under the direction of R. Ross; these references are vital as...

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Electrolytic models for metallic electromigration failure mechanisms

Cited by 37 publications

References 28 publications

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Accelerated testing and failure of thin‐film PV modules

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