Electromagnetic interference issues of power, electronics systems with wide band gap, semiconductor devices

Zare, Firuz; Kumar, Dinesh; Lungeanu, Marian; Andreas, Aupke

doi:10.1109/ecce.2015.7310494

Cited by 39 publications

(14 citation statements)

References 9 publications

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“…7 clearly depicts how both the frequency content and magnitude levels has been extended for the SiC MOSFET device when considering the noise source frequency envelopes. Similar trends from experimental measurements has been documented in [57], [61]- [63]. As can be seen from the trends in Fig.…”

Section: A Emi/emc Performancesupporting

confidence: 88%

Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview

Kjærsgaard

Liu

Nielsen

et al. 2023

IEEE Trans. Power Electron.

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Section: A Emi/emc Performancesupporting

confidence: 88%

Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview

Kjærsgaard

Liu

Nielsen

et al. 2023

IEEE Trans. Power Electron.

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“…Oscillations get more severe in the discrete package due to the high parasitic inductance of the package and printed circuit board (PCB). These oscillations have adverse effects on the convert performance such as additional power losses (Abou-Alfotouh et al, 2006;Chen, 2009;Mermet-Guyennet et al, 2012;Chen, 2014;Nayak et al, 2014;Dong et al, 2015;Jahdi et al, 2015;Liang et al, 2019;Meng et al, 2019), increased EMI noise (Gong et al, 2013;Tsai et al, 2013;Zare et al, 2015;Fang et al, 2017;Zhang et al, 2019;Zhang and Wang, 2020), shoot through (Elbanhawy, 2005;Watanabe and Itoh, 2011;Xu et al, 2013;Yanagi et al, 2014;Zhang Z. et al, 2014;Ishibashi et al, 2015;Yin et al, 2016;Wang et al, 2018) and overshoots in current and voltage (Gamand et al, 2012;Joko et al, 2015;Ando and Wada, 2017;Liang et al, 2017).…”

Section: Switching Oscillation Challengementioning

confidence: 99%

Performance Improvement Strategies for Discrete Wide Bandgap Devices: A Systematic Review

Tahir

2021

Front. Energy Res.

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Wide bandgap (WBG) devices are becoming increasingly popular due to their excellent material properties. WBG devices are commercially available in discrete and module packages. Many studies have investigated the design, structure and benefits of module packages. However, a comprehensive and in-depth overview of the discrete package is lacking. Discrete package has the advantages of flexibility, scalability and reduced cost; however, challenges of severe switching oscillations and limited current capacity are associated with it. This review encompasses the switching oscillations and limited current capacity issues of discrete devices. Switching oscillations are categorized in terms of voltage. The underlying oscillation mechanisms are explored in detail. For the current imbalance, the types, root causes and adverse effects in parallel-connected discrete devices application are reviewed. Besides, the most recent techniques to extract stray parameters are also explored. Finally, state-of-the-art methods to mitigate the switching oscillations and the current imbalance are summarized and evaluated. The performance improvement strategies discussed in this paper can assist researchers to better use the discrete package and can stimulate them to come up with new solutions.

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“…A complete EMI loop comprises three main elements: the EMI noise source, the EMI noise propagation path, and the EMI noise victim. In wide-bandgap (WBG) power electronics systems, the EMI issue is becoming an increasingly important consideration, primarily caused by the noise source side, including faster switching speed, higher switching frequency, and more oscillation than the Si counterparts [1]- [7]. In response, researchers have proposed various mitigation techniques at the source side, such as active gate driver methods [8]- [11] or optimized pulse width modulation (PWM) schemes [12]- [15], which can alleviate high commutation spikes and reduce EMI noise generated from the source.…”

Section: Introductionmentioning

confidence: 99%

Mitigating EMI Noise in Propagation Paths: Review of Parasitic and Coupling Effects in Power Electronic Packages, Filters, and Systems

Jia,

Xue,

Cui

2024

IEEE Open J. Power Electron.

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The wide applications of wide-bandgap (WBG) devices in power electronics systems bring benefits in higher switching speed, frequency, and power density, but also cause severe electromagnetic interference (EMI) issues. While many EMI mitigation methods are available to reduce the noise generated from the source (i.e. switching WBG devices), it is equally important to analyze and control the EMI propagation paths. In WBG systems, the parasitic and coupling effects become dominant due to the high switching frequency and the compact system size, which creates uncontrolled propagation paths that degrade the systems' EMI performance significantly. Therefore, it is crucial to investigate the parasitic and coupling effects and develop corresponding mitigation techniques. This review focuses on analyzing the EMI propagation paths to provide a comprehensive guideline to identify possible parasitics and couplings in the power module package level, EMI filter level, and the power electronics system level. The corresponding mitigation techniques for common-mode and differential-mode conducted EMI as well as radiated EMI are summarized, and the remaining challenges and future research topics are also discussed for all three levels in the conclusion.

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Electromagnetic interference issues of power, electronics systems with wide band gap, semiconductor devices

Cited by 39 publications

References 9 publications

Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview

Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview

Performance Improvement Strategies for Discrete Wide Bandgap Devices: A Systematic Review

Mitigating EMI Noise in Propagation Paths: Review of Parasitic and Coupling Effects in Power Electronic Packages, Filters, and Systems

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