Abstract:Due to its excellent light-weight, mechanical, and electromagnetic performance, the three-dimensional woven spacer microstrip antenna (3DWS-MA) has become a promising communication device to be applied in aerospace or high-speed vehicles. To explore the electromagnetic performance of 3DWS-MA in extreme environments, microstrip antennas based on three-dimensional woven glass fiber/epoxy spacer composites (3DWSC) with different conductive yarn (copper wire, nickel-coated carbon yarn and carbon nanotube yarn) wer… Show more
“…In addition, the and of the composite proposed here are much lower than those of conventional fabric‐reinforced composites, such as 2D glass laminated composites, 3D orthogonal composites, and so on (Figure 6F). [ 16,34 ]…”
Section: Resultsmentioning
confidence: 99%
“…[13,14] The most common products constructed with such special structure are 3D woven spacer glass/epoxy composites, which have commendable dielectric performance, low density, and superb mechanical properties. [15,16] Nevertheless, owing to relatively high density of glass fiber and the low heat resistance of epoxy resin, the application of the composites is limited to some extent, especially in high temperature environment. [17] For the point of low density and high temperature resistance, Kevlar fiber and polyimide matrix show unique advantages, respectively.…”
Polymer matrix composites with lightweight, low dielectric constant (ε) and dielectric loss tangent (tan δ), high‐temperature resistance, and excellent mechanical properties are urgently needed in the fields of aviation, aerospace, transportation, and wireless communication services. In this work, 3D woven spacer Kevlar/polyimide composites (3DKPC) with excellent dielectric properties and robust mechanical properties were designed and obtained by combining 3D weaving technology and thermal imidization process. Results show that the volume density of the prepared composites is as low as 0.24 g·cm−3, but its compressive strength can be up to 6.24 MPa. The dielectric constant and loss tangent of 3DKPC at room temperature are extremely low, with the value of ~1.32 and 6.9 × 10−3, respectively. Moreover, the compressive strength retention rate is more than 96% and the dielectric constant can be consistently lower than 1.36 when the temperature increases from 25 to 300°C, demonstrating the outstanding mechanical and dielectric stability of 3DKPC. In addition, as an application example of resulting composites, a microstrip antenna with 3DKPC as the substrate material was designed, followed by the simulation of its electromagnetic properties via High Frequency Structural Simulator. The results display that the gain of the microstrip antenna is 6.2 dB, which is superior to those of many other reported microstrip antennas, indicating that the 3DKPC proposed here has great application potential in aerospace, wireless communication, and other fields.
“…In addition, the and of the composite proposed here are much lower than those of conventional fabric‐reinforced composites, such as 2D glass laminated composites, 3D orthogonal composites, and so on (Figure 6F). [ 16,34 ]…”
Section: Resultsmentioning
confidence: 99%
“…[13,14] The most common products constructed with such special structure are 3D woven spacer glass/epoxy composites, which have commendable dielectric performance, low density, and superb mechanical properties. [15,16] Nevertheless, owing to relatively high density of glass fiber and the low heat resistance of epoxy resin, the application of the composites is limited to some extent, especially in high temperature environment. [17] For the point of low density and high temperature resistance, Kevlar fiber and polyimide matrix show unique advantages, respectively.…”
Polymer matrix composites with lightweight, low dielectric constant (ε) and dielectric loss tangent (tan δ), high‐temperature resistance, and excellent mechanical properties are urgently needed in the fields of aviation, aerospace, transportation, and wireless communication services. In this work, 3D woven spacer Kevlar/polyimide composites (3DKPC) with excellent dielectric properties and robust mechanical properties were designed and obtained by combining 3D weaving technology and thermal imidization process. Results show that the volume density of the prepared composites is as low as 0.24 g·cm−3, but its compressive strength can be up to 6.24 MPa. The dielectric constant and loss tangent of 3DKPC at room temperature are extremely low, with the value of ~1.32 and 6.9 × 10−3, respectively. Moreover, the compressive strength retention rate is more than 96% and the dielectric constant can be consistently lower than 1.36 when the temperature increases from 25 to 300°C, demonstrating the outstanding mechanical and dielectric stability of 3DKPC. In addition, as an application example of resulting composites, a microstrip antenna with 3DKPC as the substrate material was designed, followed by the simulation of its electromagnetic properties via High Frequency Structural Simulator. The results display that the gain of the microstrip antenna is 6.2 dB, which is superior to those of many other reported microstrip antennas, indicating that the 3DKPC proposed here has great application potential in aerospace, wireless communication, and other fields.
“…To reduce the weight of a microstrip antenna with a 3D woven orthogonal structure and improve its gain performance, Xu et al studied a microstrip antenna with a 3D woven spaced structure in Figure 1(d) using glass fiber and carbon fiber covered yarn. 12 Although it achieved lightweight, it was difficult to form, it was necessary to manually paste the resin layer by layer to each yarn, its upper and lower panels rely on the yarn connection, 13 the yarn support was weak; and the surface of the panel was easy to collapse when it was impacted and compressed.Figure 1.Microstrip antenna structure (a) Laminated structure (b) Honeycomb sandwich structure (c) 3D woven orthogonal structure (d) 3D woven “8” spacing structure (e) 3D woven hollow structure.…”
With the popularity of 5 G, there is an increasing request for a light, high-performance, and stable structure for wireless communication. To solve the problems of delamination cracking and its own heavy weight of the conventional microstrip antenna, this study used ultra-high molecular weight polyethylene (UHMWPE) filament tows and purple copper filament tows as raw materials to prepare 3D woven hollow structure microstrip antenna preforms on a common loom. Using the prepared preforms for reinforcement and resin as the matrix, the VARTM process was used to prepare a 3D woven hollow structure microstrip antenna with a height of 6.8 mm, a weight of 35 g, and a bulk density of 0.7 g/cm3. The combination of the electromagnetic performance test and HFSS software simulation shows that the antenna has excellent radiation performance with a gain of 7.5 dB and a measured VSWR of 1.25. The mechanical performance test results show that it can withstand a maximum compression load of 2982 N and a maximum bending load of 364 N with no obvious delamination at the fracture. It is light, thin, and load-bearing with excellent radiation performance. There will be great potential in the unmanned field and the space field in the future.
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