Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints

Park, Jae‐Yong; Lee, Taeyoung; Seo, Wonil; Yoo, Sehoon; Kim, Young‐Ho

doi:10.1007/s10854-019-01080-y

Cited by 6 publications

(1 citation statement)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Recent improvements in performance and node size decrease in semiconductors lead to a lowering in the bump pitch of the semiconductor package [ 1 , 2 , 3 ]. The fine-pitch semiconductor packages have brought about a huge change in the flip-chip bonding process and materials.…”

Section: Introductionmentioning

confidence: 99%

Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

et al. 2023

Self Cite

View full text Add to dashboard Cite

Thermo-compression bonding (TCB) properties of Cu/SnAg pillar bumps on electroless palladium immersion gold (EPIG) were evaluated in this study. A test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the TCB method. The surface roughness of the EPIG was 82 nm, which was 1.6 times higher than that of the ENEPIG surface finish because the EPIG was so thin that it could not flatten rough bare Cu pads. From the cross-sectional SEM micrographs, the filler trapping of the TC-bonded EPIG was much higher than that of the ENEPIG sample. The high filler trapping of the EPIG sample was due to the high surface roughness of the EPIG surface finish. The contact resistance increased as the thermal cycle time increased. The increase of the contact resistance with 1500 cycles of the thermal cycle test was 26% higher for the EPIG sample than for the ENEPIG sample.

show abstract

Section: Introductionmentioning

confidence: 99%