Electron backscatter diffraction study for advanced semiconductor interconnect materials analysis

Abstract

Chapter 5 is published as A. Lee, B. Zee and F.J. Foo, "Application of EBSD Study of Cu-Sn IMCs in SAC305 and Sn0.7Cu Solder Joints to Determine the Suitability of Sn0.7Cu Solder as Alternative in Mitigating ILD Cracks/Delamination," in proceedings of the 23 rd Electronics Packaging Technology Conference (EPTC), 2021.The contributions of the co-authors are as follows:• B. Zee provided the initial project direction and scope.• I co-designed the study with B. Zee.• I performed all the laboratory work at the Advanced Micro Devices, Inc (Singapore) Device Analysis Laboratory. I also analyzed the data and prepared the manuscript draft.• The manuscript was revised by B. Zee and F.J. Foo.