2011
DOI: 10.1515/polyeng.2011.007
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Electron beam modification of space durable polymeric nano-adhesive bonding of ultra-high temperature resistant polymer

Abstract: This investigation highlights fabrication of ultra-high temperature resistant polymers such as polybenzimidazole (PBI) by high-performance nano-adhesive. High-performance nanoadhesive is prepared by dispersing carbon nano-fi bers into ultra-high temperature resistant epoxy adhesive. Prior to fabrication of PBI, the surface of PBI is ultrasonically cleaned by acetone and then modifi ed by atmospheric pressure plasma with 30, 60 and 90 s of exposure and low-pressure plasma with 30, 60, 120, 240 and 480 s of expo… Show more

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Cited by 9 publications
(4 citation statements)
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“…As with PS [23], the radiation absorbed by the aromatic groups had a total energy content in excess of that required for bond scission producing free radicals on the PBI surface by reaction (2). Reactions (3)(4)(5)(6)(7) illustrate the formation of carbonyl-containing compounds involving the R• free radical [23].…”
Section: Discussionmentioning
confidence: 99%
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“…As with PS [23], the radiation absorbed by the aromatic groups had a total energy content in excess of that required for bond scission producing free radicals on the PBI surface by reaction (2). Reactions (3)(4)(5)(6)(7) illustrate the formation of carbonyl-containing compounds involving the R• free radical [23].…”
Section: Discussionmentioning
confidence: 99%
“…Poly 2,2'-m-(phenylene)-5,5'-bibenzimidazole, better known as polybenzimidazole (PBI), or meta-PBI, is a high-performance polymer consisting of benzimidazole units, as shown in the Figure 1. PBI has high thermal stability, chemical resistivity, and mechanical strength, making it suitable for many applications [1][2][3][4], such as in high-temperature fuel cells [1,2,5,6]; redox flow batteries [7][8][9]; protective thermal coatings [3], and aerospace industries, where PBI may be exposed to ozone and UV radiation [4].…”
Section: Introductionmentioning
confidence: 99%
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“…Several attempts have been made to reduce the adhesive thickness while maintaining the high adhesive strength by surface modification, such as pretreatment of the target substrate with e-beam or γ radiation or chemical modification. However, the effect of such treatments is temporary in most cases. The chemical modification of the substrate often requires specific surface functionalities on the substrate, and the modification procedure might be quite complicated, which substantially limits its applicability to various kinds of substrate materials.…”
Section: Introductionmentioning
confidence: 99%