2021
DOI: 10.1088/1361-6501/abd96d
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Electron microscopy in semiconductor inspection

Abstract: Currently, semiconductor devices are manufactured in a technology node of several nanometers. Electron microscopy is mainly used in semiconductor inspection in manufacturing stages since accelerated electrons have wavelengths of nanometers or less, and a high spatial resolution can be expected. Among various electron microscopes since the scanning electron microscope (SEM) can observe the sample as it is without processing the sample, the SEM-based inspection instrument is mainly used at each stage of manufact… Show more

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Cited by 30 publications
(11 citation statements)
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“…The wetting properties of surfaces can be tuned by the judicious choice of the material, modifying the surface chemistry and controlling the surface morphology (i.e., surface roughness and asperities which trap air). The characterization of the surface morphology is typically done using either a surface optical or mechanical profilometer, scanning electron microscopy (SEM) [ 142 ], and transmission electron microscopy (TEM) [ 143 ]. To achieve greater lateral and vertical resolution, atomic force microscopy (AFM) [ 144 , 145 , 146 , 147 ] is commonly used with the added advantage that samples do not need to be conductive.…”
Section: Characterization Of the Static And Dynamic Wetting Propertie...mentioning
confidence: 99%
“…The wetting properties of surfaces can be tuned by the judicious choice of the material, modifying the surface chemistry and controlling the surface morphology (i.e., surface roughness and asperities which trap air). The characterization of the surface morphology is typically done using either a surface optical or mechanical profilometer, scanning electron microscopy (SEM) [ 142 ], and transmission electron microscopy (TEM) [ 143 ]. To achieve greater lateral and vertical resolution, atomic force microscopy (AFM) [ 144 , 145 , 146 , 147 ] is commonly used with the added advantage that samples do not need to be conductive.…”
Section: Characterization Of the Static And Dynamic Wetting Propertie...mentioning
confidence: 99%
“…The 28-nm technology node gained popularity in 2013, and the introduction of UV lithography gave rise to the 7 nm technology node in 2019 (Nakamae, 2021). Smaller feature sizes place greater demands on new lithography processes and advanced quality inspection methods.…”
Section: Introductionmentioning
confidence: 99%
“…As a typical example, the integrated circuit (IC) industry has been developing continuously according to the well‐known Moore's law in the past few decades (Orji et al, 2018). The 28‐nm technology node gained popularity in 2013, and the introduction of UV lithography gave rise to the 7 nm technology node in 2019 (Nakamae, 2021). Smaller feature sizes place greater demands on new lithography processes and advanced quality inspection methods.…”
Section: Introductionmentioning
confidence: 99%
“…Presently, this is difficult to achieve noninvasively without causing damage to the circuit or surrounding packaginga factor especially important for biological tissue. Existing methods for integrated circuit inspection such as laser voltage probing [2], electron microscopy [3], THz spectroscopy [4] and electrophysiology probes [5] or fluorescence microscopy [6] for biosystems require unimpeded local access. Furthermore, these existing techniques are all active, requiring direct interaction with the target system.…”
Section: Introductionmentioning
confidence: 99%