Electron Spectroscopy for Chemical Analysis Study of Corrosion Films Formed on Manganese Stainless Steels

Abstract

Films formed on two grades of Mn stainless steels in 1 M hydrochloric acid (HCl) freely exposed to air at different potentials were examined using electron spectroscopy for chemical analysis (ESCA). The Cr content of the film, which is related closely to corrosion resistance of the base alloys, was lower within the films formed on Mn stainless steels as compared to a normal type 304 (UNS S30400) stainless steels. The film also contained significant amounts of Mn, Ni, and Cu. It was proposed that the presence of higher amounts of Mn, an electrochemically active element, with Cu resulted in poor passivation behavior of the present high Mn stainless steels.

The Role of Oxide Films on TiS and Ti4C2S2Inclusions in the Pitting Corrosion Resistance of Stainless Steels

“…46 The oxide enriched layer on the inclusion surfaces is expected to determine the electrochemical stability of the inclusions. The corrosion resistance of Mn-oxide films is relatively low in NaCl solutions, 41 and the breakdown of the oxide films most likely occurs under anodic polarization. Therefore, the MnS inclusion dissolves, and pits are readily initiated at the boundaries of the inclusions and the steel matrix.…”

Long term and electrochemical corrosion investigation of cold worked AISI 316L and 316LVM stainless steels in simulated body fluid

“…The lm of Cr and Fe is made up of two layers-an oxide and a hydroxide. A bilayer passive lm composed of oxide and hydroxide was also proposed by Raja et al 40 Elemental peaks were not detected for Fe and Cr. Nickel and manganese were absent from both samples.…”

Effect of corrosion product layer on SCC susceptibility of copper containing type 304 stainless steel in 1 M H2SO4

“…The presence of elements namely Si, S, Cr, Fe, Ni and Cu in the surface corrosion product indicates that the exposure of the alloy to the test environment results in the initial dissolution of the base alloy which is followed by the film buildup. The Cu enrichment in the surface film could occur either by the dissolution of electrochemically less noble elements from the surface film or by the re-deposition of electrochemically, more noble Cu from the test solution into surface film [15].…”