Defects present at the Si(100)/HfO 2 interface are analyzed using a combination of electron spin resonance ͑ESR͒ and frequencydependent impedance analysis. The 3.4 nm HfO 2 layers were formed by injection metalorganic chemical vapor deposition on boron-doped silicon ͑100͒ substrates. ESR spectra indicate the presence of P b0 defects ((5.0 Ϯ 0.4) ϫ 10 12 cm Ϫ2 ), while analysis of the low-frequency ͑20 Hz͒ capacitance-voltage ͑CV͒ response indicates a defect density of (5.8 Ϯ 1.1) ϫ 10 12 cm Ϫ2 , between 0.1 and 0.56 eV above the valence bandedge (E v ), with the peak density located at E v ϩ 0.28 eV. Analysis of conductance data reveals an interface state density of (8.4 Ϯ 2.1) ϫ 10 12 cm Ϫ2 , with a peak density observed at E v ϩ 0.27 eV. These results provide a link between the density of P b centers measured by ESR, and the electrical active defects measured from CV and conductance analysis. This provides an explanation for the nonideal, frequency-dependent features in the region between accumulation and strong inversion for high-MOS structures.One of the major challenges associated with the continued scaling of silicon based metal oxide silicon ͑MOS͒ technology is the requirement for high dielectric constant ͑high-͒ materials to replace SiO 2 as the gate layer of MOS field-effect transistors ͑MOSFETs͒. High-materials research is driven by the need to reduce gate insulator leakage current densities while maintaining the capacitance per unit area of the gate stack. A wide range of metal oxides are currently being studied, including ZrO 2 , HfO 2 , Al 2 O 3 , Pr 2 O 3 as well as metal silicates and aluminates. 1 The understanding and control of the properties of the interface between silicon and the high-material is one of the most important issues for the successful integration of high-films as the gate oxide layer of MOSFETs.Previous studies based on electron spin resonance ͑ESR͒ have established that for Al 2 O 3 and ZrO 2 layers deposited on silicon by atomic layer chemical vapor deposition ͑ALCVD͒, the dominant ESR active interface defects are the P b silicon dangling bond defects 2 detected at the Si͑100͒/insulator interface. 3,4 The density of the P b0 and P b1 centers were characteristic of an SiO 2 film grown at a low temperature (ϳ300°C). It was necessary to expose the samples to UV irradiation at 8.48 eV for photodissociation of hydrogen from the interface defects, to observe the P b centers. An ESR analysis of HfO 2 films deposited on Si͑111͒ by ALCVD using a Hf(NO 3 ) 4 precursor, also indicated an interface dominated by silicon dangling bond centers, albeit with some dissimilarities as compared to the standard high-temperature Si(111)/SiO 2 interface, 5 as outlined previously. 2 In relation to the electrical activity of the interface defects in the Si͑100͒/high-system, it has been reported that capacitance-voltage ͑CV͒ characteristics have a nonideal behavior, with a frequency-dependent feature in the region between accumulation and strong inversion for ZrO 2 and HfO 2 MOS structures. 5-9 Modeling ...