“…[9,8] the pair is then split apart, using a process that leaves a thin (relative to the thickness of the starting wafer), device-quality layer of single crystal silicon on top of the oxide layer (which has now become the BOX) on the handle wafer. This [10,11,12] is called the "layer transfer" technique, because it transfers a thin layer of device-quality silicon onto an oxide layer that was thermally grown on a handle wafer.…”