The dc current-stress tolerance of the ON-state Cu atom switch is evaluated at elevated temperature. It is revealed that the reset-direction current stress causes timedependent failures, which originate from the E-field-driven diffusion of Cu in the conducting bridge. A new empirical lifetime estimation model, including the Joule heating effect, gives an allowable maximum current per atom switch of I max = 115 µA, which is large enough to satisfy the requirements for signal routing under currents that are average (18 µA) and peak (63 µA) in the reconfigurable switch block operated at 500 MHz at 125°C.Index Terms-Atom switch, field-programmable gate array, nonvolatile memory, programmable logic device, polymer, reconfigurable logic, solid electrolyte. Toshitsugu Sakamoto received the B.S., M.S., and Ph.D.