Electronic Configuration in Electrodeposition from Aqueous Solution

Abstract

The cathodic behavior of cobalt, nickel, copper, and zinc complexes of 8-hydroxyquinoline-5-sulfonic acid, 1,10-phenanthroline, glycine, 1,2-and 1,8-naphthalenediamines, tetramethylethylenediamine, and dimethylglyoxime was investigated by determining cathode current effciencies and polarograms. Deposition was not obtained from ions believed to have hybridized orbitals which involve the penultimate electron shell, that is, from the "inner orbital" complexes of Taube Deposits were obtained from "outer orbital" ions, thus confirming the rule previously proposed. Evidence is given that copper, as well as cobalt and nickel, forms both types of ions.

Electrodeposited semiconducting molybdenum selenide films. I. Preparatory technique and structural characterisation

“…In general metals can not be deposited from aqueous solutions if their electrode potentials are more negative than the hydrogen discharge potential, as is the case for molybdenum. The molybdate ion is stabilised by its inner orbital hybridisation in which the 4d orbitals are hybridised with 5s and p orbitals (Lyons 1954). The energy required for breaking such hybridisation exceeds the energy necessary for the cathodic discharge of hydrogen.…”

75th Anniversary Review Series Progress in Electrodeposition and Related Processes‐1952–1977

“…Important developments were in the areas of mechanisms of crystal growth stages (16), dendritic (17) and whisker growth (18), energetics of metal ion-metal charge transfer (19,20) and the effects of foreign substances on the inhibition of crystal growth (21)(22)(23). The effects of electronic configuration and complex structure on deposition of metal ions have been investigated (24). It is anticipated that continued development in deposition mechanisms will stimulate technological advances.…”

Cathode Overpotential and Surface-Active Additives in the Electrodeposition of Copper

“…It is generally believed that the effect of addition agents on cathode overpotential (or polarization) during electrodeposition of metals arises primarily because of adsorption of the additive on the cathode surface (1)(2)(3)(4)(5)(6)(7)(8)(9). Possible coordination with the metal ions in solution might also have an effect (6)(7)(8)(10)(11)(12)(13)(14). In addition, the ability of the additive to impede metalion transport in the cathode film could play a more minor role (15).…”