Electronic module for controlling the energy in a Vapour Phase Soldering machine

Plotog, Ioan; Svasta, Paul; Mihailescu, Bogdan; Varzaru, Gaudentiu; Busu, Iulian

doi:10.1109/siitme.2009.5407340

Cited by 8 publications

(2 citation statements)

References 1 publication

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“…The Electric Motor block represents the load whose operating parameters values are returned to the microcontroller for analysis through the feedback loop for assessment in order to decide the next command to be given. An important feature of the SSR named above is the zero cross detection [2]. There are two conditions necessary for the SSR to switch:…”

Section: A Electronic Control Modulementioning

confidence: 99%

Start Soft Stop for controlling a reversible electric motor used in automotive

Mihailescu

Vasile

Sauseng

et al. 2011

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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Accumulators used in electric vehicles being in production to date have the disadvantage of a limited number of charge-discharge cycles (lead-acid accumulators) or high acquisition price (NiMH, Li-Ion) and long full recharge duration. This paper presents a study on a solution to increase the life cycle of a typical battery pack used in automotive applications by recovering the deceleration energy (power generation control) and its storage in a battery of Electrochemical Double-Layer Capacitor (EDLC). Electronic module named Start Soft Stop(SSS) allows the control of energy transmitted to the electric motor, including the start and stop phases. The method used has minimal electromagnetic interference due to switching of the power semiconductor device as it passes through zero voltage. EDLC allows rapid storage and release of energy of 300 -400A if needed without using the energy stored in the battery system.

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Section: A Electronic Control Modulementioning

confidence: 99%

Start Soft Stop for controlling a reversible electric motor used in automotive

Mihailescu

Vasile

Sauseng

et al. 2011

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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“…VP soldering allows for the processing of all components (even BGAs and CSPs) without any complicated calculations or the need to maintain temperature controls, as with conventional reflow methods (Illés and Harsányi, 2009;Illés, 2010;Lau et al, 2013;Plotog et al, 2009). Besides, VP soldering provides long-term reliable reproducibility of processing conditions (Willis, 2008).…”

Section: Introductionmentioning

confidence: 99%

Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering

Krammer

2014

Soldering &Amp; Surface Mount Technology

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Purpose – The purpose of this paper is to compare the reliability and intermetallic layer (IML) of solder joints prepared with infrared (IR) and vapour phase (VP) soldering. The reliability of 0603-sized resistors’ solder joints formed with IR and VP soldering was investigated. The IML of the joints was analysed based on image processing algorithm automatically. Design/methodology/approach – For the reliability analyses, the ageing method was a highly accelerated stress test (HAST) with +105°C maximum temperature, fully saturated (100 per cent) relative humidity at +0.5 atm overpressure. The joints were characterised based on the thickness of their IML and on their shear strength in as-reflowed stage, and after 400, 800, 1,200, 1,600 and 2,000 hours of HAST. An image processing algorithm was developed to measure the thickness of the IMLs on cross-sectional scanning electron microscopy (SEM) images automatically. Findings – The increase of the IML thickness is lower in the case of HAST ageing compared to other methods. The thickness increment of the Cu6Sn5 layer was higher for IR and lower for VP soldering; the Cu3Sn layer cannot be inspected even after 2,000 hours of HAST ageing. The results of shear strength measurements show better reliability for VP soldered joints. Practical implications – The developed image processing method is applicable to obtain quantitative results about the IMLs in an effective fast way. Originality/value – There is a lack of information in the literature regarding the reliability comparison of solder joints formed with VP and conventional reflow processes. Thus, we performed research about the lifetime of solder joints formed with VP and IR reflow method.

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Heat Level Mode in Vapour Phase Soldering Using Lead-Free Solder Paste for Surface Mount Technology: A Review

Syarfa

Mokhtar

2021

Lecture Notes in Mechanical Engineering

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Electronic module for controlling the energy in a Vapour Phase Soldering machine

Cited by 8 publications

References 1 publication

Start Soft Stop for controlling a reversible electric motor used in automotive

Start Soft Stop for controlling a reversible electric motor used in automotive

Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering

Heat Level Mode in Vapour Phase Soldering Using Lead-Free Solder Paste for Surface Mount Technology: A Review

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