Electronic Packaging: Materials and Their Properties

Pecht, Michael; Agarwal, Rakish; McCluskey, F. Patrick; Dishongh, Terry; Javadpour, Sirus; Mahajan, Rahul

doi:10.1201/9781315214153

Cited by 62 publications

(19 citation statements)

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“…One of such indispensable elements in microelectronics is dielectric materials utilized in electronic insulation and packaging . Polymers are preferred dielectric materials owing to their ease of processing, tunable dielectric constants, low cost, and excellent film‐forming ability .…”

Section: Introductionmentioning

confidence: 99%

Self‐Healable Polymer Nanocomposites Capable of Simultaneously Recovering Multiple Functionalities

Xing

Zhang

et al. 2016

Adv Funct Materials

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The continuous evolution toward electronics with high power densities and integrated circuits with smaller feature sizes and faster speeds places high demands on a set of material properties, namely, the electrical, thermal, and mechanical properties of polymer dielectrics. Herein, a supramolecular approach is described to self‐healable polymer nanocomposites that are mechanically robust and capable of restoring simultaneously structural, electrical, dielectric, and thermal transport properties after multiple fractures. With the incorporation of surface‐functionalized boron nitride nanosheets, the polymer nanocomposites exhibit many desirable features as dielectric materials such as higher breakdown strength, larger electrical resistivity, improved thermal conductivity, greater mechanical strength, and much stabilized dielectric properties when compared to the pristine polymer. It is found that the recovery condition has remained the same during sequential cycles of cutting and healing, therefore suggesting no aging of the polymer nanocomposites with mechanical breakdown. Moreover, moisture has a minimal effect on the healing and dielectric properties of the polymer nanocomposites, which is in stark contrast to what is typically observed in the hydrogen‐bonded supramolecular structures.

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Section: Introductionmentioning

confidence: 99%

Self‐Healable Polymer Nanocomposites Capable of Simultaneously Recovering Multiple Functionalities

Xing

Zhang

et al. 2016

Adv Funct Materials

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“…Neste caso, a adesão metal-cerâmica ocorre devido à formação do CuAl 2 O 4 , similar ao observado no processo DBC para o Al 2 O 3 [5]. Nos últimos anos, observaram-se estudos sobre a utilização da tecnologia DBC na fabricação de diodos emissores de luz (LED, light emitting diode) [5,12]. No caso dos módulos de LED de alta potência, aspiramse materiais de encapsulamento com elevada condutividade térmica, pois o LED não irradia calor paro o exterior, como observado na lâmpada de bulbo convencional [5].…”

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“…Os processos HTCC e DBC foram desenvolvidos industrialmente usando alumina como substrato cerâmico [5,10]. Habitualmente, este substrato é processado com 90% a 96% em massa de Al 2 O 3 , sendo adicionados 4% a 10% em massa de um composto do sistema SiO 2 -MgO-CaO para promover a densificação entre 1400 e 1500 ºC (viabilização do processo HTCC) e melhorar a aderência metal-cerâmica (otimização do processo DBC) [12]. Apesar de sua ampla comercialização, o Al 2 O 3 tem baixa condutividade térmica (20-24 W/mK à temperatura ambiente), bem como elevado coeficiente de expansão térmica (6,9-7,2x10 -6 ºC -1 ) em relação ao chip de silício (3,2x10 -6 ºC -1 ) [13].…”

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Processamento, propriedades e aplicações das cerâmicas de nitreto de alumínio

Molisani

2017

Cerâmica

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INTRODUÇÃOA tecnologia planar em silício possibilitou a fabricação de dispositivos eletrônicos miniaturizados (circuitos integrados ou chips). Este processo avançou até atingir dimensões que resultaram em problemas tanto de flexibilização funcional como de custos efetivos, que inviabilizaram a produção de chips com alta complexidade. Os referidos problemas foram solucionados com o advento da tecnologia de circuitos passivos, que é responsável pela fabricação de substratos e componentes para encapsulamento (packaging), os quais são acoplados ao chip de silício para fornecer interconexão,

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“…Electronic packaging, materials and their properties influence the reliability of electronic assemblies [5]. In this study, only the thermomechanical properties and mechanics of material models will be reviewed.…”

Section: Chapter 2 Literature Review 21 Materials Properties For Elementioning

confidence: 99%

Development of failure assessment methodology for lead-free electronic assembly

Xing¹

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The function and reliability of electronic product are very important concerns for customers and product users. Hence, methods to improve and predict the service life of electronic products are significant challenges for ongoing research on design for reliability. Lead-free solders will replace tin-lead solders in electronic products due to European Union laws to restrict the use of lead (Pb) by July 1 st , 2006. Solder is the weakest link material in electronic assemblies and failures are often caused by solder joint failures. In this study, reliability test and analysis methodology for lead-free (Pb-free) soldered assemblies subjected to thermal cycling, cyclic bend, drop impact and vibration loadings are investigated. Finite element analysis (FEA) is used as a numerical modeling tool for simulating solder micro-deformation and integrated with solder fatigue failure analysis assessment. In this project, a failure assessment methodology for modeling Pb-free (and Pb-based) soldered assemblies is proposed. A global-local submodeling finite element analysis technique is developed and compared with full 3D model results. The global-local FEA technique reduces computational effort and resources significantly (i.e. hard disk space, memory, and computational time). The global-local submodeling method results in good agreement with full 3D model results. A global-local beam (GLB) method is proposed for approximate application for vibration analysis. The global-local modeling technique is applied on reliability issue when electronic assembly subjected to different loadings such as thermal cycling, cyclic bending, drop impact and vibration.

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Electronic Packaging: Materials and Their Properties

Cited by 62 publications

References 0 publications

Self‐Healable Polymer Nanocomposites Capable of Simultaneously Recovering Multiple Functionalities

Self‐Healable Polymer Nanocomposites Capable of Simultaneously Recovering Multiple Functionalities

Processamento, propriedades e aplicações das cerâmicas de nitreto de alumínio

Development of failure assessment methodology for lead-free electronic assembly

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