Electronic Properties and Chemical Bonding of Orthorhombic Chromium Carbide

Posada-Amarillas, Álvaro; Galvn, D.H.; Castilln, F.F.; valos-Borja, M.

doi:10.1002/1521-3951(200202)229:3<1353::aid-pssb1353>3.0.co;2-o

Cited by 3 publications

(1 citation statement)

References 26 publications

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“…The electronic structures of metal carbides such as titanium carbide, chromium carbide are quite complex. For example, chemical bonding in chromium carbides has a complex mixture of metallic, covalent, and ionic characters, and this means both electrons and phonons could participate in the heat transfer process [74][75][76]. Hence, what matters is the variety of particles that contribute to the thermal transport process across the interface and to quantify and formulate the process.…”

Section: Thermal Boundary Conductancementioning

confidence: 99%

High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.

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Section: Thermal Boundary Conductancementioning

confidence: 99%

High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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First-principles study of structural, elastic, and electronic properties of chromium carbides

Jiang¹

2008

Applied Physics Letters

125

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Using first-principles calculations, we systematically studied the structural, elastic, and electronic properties of the technologically important chromium carbides: Cr3C2, Cr7C3, Cr23C6, Cr3C, and CrC. Our calculations show that the ground state structure for Cr7C3 is hexagonal, not orthorhombic. We further predict WC to be the energetically most stable structure for CrC. Our results indicate that all chromium carbides considered in this study are metallic and mechanically stable under the ambient condition. Among all chromium carbides, WC-type CrC exhibits the highest bulk and shear moduli and the lowest Poisson’s ratio, and is a potential low-compressibility and hard material.

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