Electronic properties and viscosity of liquid Pb–Sn alloys

Plevachuk, Yu.; Sklyarchuk, V.; Yakymovych, A.; Willers, B.; Eckert, Sven

doi:10.1016/j.jallcom.2004.10.051

Cited by 52 publications

(14 citation statements)

References 11 publications

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“…As can also be seen from Fig. 3, the line of q obtained by Plevachuk et al 9 for the Pb-Sn melt is somewhat higher than those relating to the solid phases. This result is expected, because liquid alloy with a relatively disordered arrangement of ions has higher resistivity than a crystalline solid alloy with its more regular arrangement, and the electron mean free path is shorter when moving through a disordered liquid.…”

Section: Influence Of Sn Content On Electrical Resistivity Of Pb-sn Ssupporting

confidence: 54%

“…The intensive interest in these solder alloys is attributed to their low cost and unique material properties including high superplastic properties, low melting temperature, wettability, and good electrical and thermal conductivities. [5][6][7][8][9][10] The electrical resistivity of Pb-Sn alloys at room temperature is well known, but few studies have been carried out on the dependence of electrical resistivity of Pb-Sn alloys on temperature and alloy composition. Thus, the aim of the present work is to investigate the dependence of electrical resistivity and thermal conductivity on temperature and Sn content in Pb-Sn solders.…”

Section: Introductionmentioning

confidence: 99%

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Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

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et al. 2010

Journal of Elec Materi

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Pb (100Àx) -Sn x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 lm/s) in a temperature gradient (G = 4.8 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (q) with temperature in the range of 323 K to 423 K for the directionally solidified Pb-Sn solders were measured. The present measurements indicate that the electrical resistivity of the directionally solidified Pb-Sn solders increases with increasing temperature, whereas the resistivity of the Pb-Sn solders decreases with increasing Sn content. The dependency of the Lorenz number (L) on temperature and Sn content for the Pb-Sn solders was also investigated based on the Wiedemann-Franz law by using the measured values of the thermal (K) and electrical (r) conductivity for the same alloys.

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Section: Influence Of Sn Content On Electrical Resistivity Of Pb-sn Ssupporting

confidence: 54%

Section: Introductionmentioning

confidence: 99%

Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

Çadırlı

Böyük

Kaya

et al. 2010

Journal of Elec Materi

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“…[17] Using the modified Roscoe equation, the temperature dependence of the dynamic viscosity, g(T), has been calculated from the corresponding logarithmic decrement and the period of oscillations. The experiments were performed in helium atmosphere under a negligible excess pressure of about 0.02 to 0.03 MPa.…”

Section: B Viscositymentioning

confidence: 99%

Density, Viscosity, and Electrical Conductivity of Hypoeutectic Al-Cu Liquid Alloys

Plevachuk

Sklyarchuk

Yakymovych

et al. 2008

Metall Mater Trans A

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New workable aluminum-based light alloys are a key issue in current materials science. In this work, thermophysical properties (density, viscosity, and electrical conductivity) of liquid Al-4 wt pct Cu, Al-20 wt pct Cu, Al-30 wt pct Cu, and AlCu4TiMg alloys have been measured in a wide temperature range. The anomalies with respect to the concentration dependence of the electrical conductivity are explained in terms of the s-d hybridization model. A comparison with data and scaling relations available in the literature is given.

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“…Even at the same temperature, different heating or cooling processes will have different effects on the properties of liquid metals. Plevachuk et al [53] revealed discrepancies between heating and cooling curves of temperature dependencies of some electro physical and structuralsensitive properties. Except for bismuth, gallium is the only element which expands on cooling, with a volume increase of 3.2% during solidification.…”

Section: Thermal Properties Of Liquid Metalsmentioning

confidence: 99%

Liquid metal cooling in thermal management of computer chips

Jing

2007

Front. Energy Power Eng. China

148

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With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the heat to escape. The total power-dissipation levels now reside on the order of 100 W with a peak power density of 400-500 W/cm 2 , and are still steadily climbing. As a result, it is extremely hard to attain higher performance and reliability. Because the conventional conduction and forcedair convection techniques are becoming incapable in providing adequate cooling for sophisticated electronic systems, new solutions such as liquid cooling, thermoelectric cooling, heat pipes, vapor chambers, etc. are being studied. Recently, it was realized that using a liquid metal or its alloys with a low melting point as coolant could significantly lower the chip temperature. This new generation heat transfer enhancement method raised many important fundamentals and practical issues to be solved. To accommodate to the coming endeavor in this area, this paper is dedicated to presenting an overall review on chip cooling using liquid metals or their alloys as coolant. Much more attention will be paid to the thermal properties of liquid metals with low melting points or their alloys and their potential applications in the chip cooling. Meanwhile, principles of several typical pumping methods such as mechanical, electromagnetic or peristaltic pumps will be illustrated. Some new advancement in making a liquid metal cooling device will be discussed. The liquid metal cooling is expected to open a new world for computer chip cooling because of its evident merits over traditional coolant.

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Electronic properties and viscosity of liquid Pb–Sn alloys

Cited by 52 publications

References 11 publications

Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

Density, Viscosity, and Electrical Conductivity of Hypoeutectic Al-Cu Liquid Alloys

Liquid metal cooling in thermal management of computer chips

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