Electroplated compliant metal microactuators with small feature sizes using a removable SU-8 mould

Vestergaard, Ras K.; Bouwstra, S.

doi:10.1007/s005420000059

Cited by 10 publications

(7 citation statements)

References 1 publication

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“…To overcome these problems, we consider surface micromachining used with the SU-8 resist (EPON SU-8, Micro Chemical Co) and electroplated copper (Cu) which are materials of thermal insulation and thermal path layers, respectively. The thermal conductivity of SU-8, about 0.2 W m −1 K −1 , is much smaller than that of SiO 2 , about 1.4 W m −1 K −1 , and it is easy to make a thick SU-8 layer in the range of 50-100 µm by spin coating [9,10].…”

Section: Device and Fabricationmentioning

confidence: 99%

Micro heat flux sensor using copper electroplating in SU-8 microstructures

Lee

Chun

et al. 2001

J. Micromech. Microeng.

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A micro heat flux sensor which can measure the thermal energy transfer per unit area has been designed, fabricated, and calibrated in a convective environment. The sensor which is based on a circular foil gage is composed of thermal paths and a thermopile. The thermal path is made in a LIGA-like process of SU-8 high aspect ratio microstructures and electroplated copper layers. The thermopile, a series of thermocouples, is used to amplify the output signal as a thermometer. When the sensor is placed on a high-temperature wall, heat flux from the wall flows through thermal paths and drains out to the environment, producing a temperature difference along its paths. Heat flux is obtained by calibrating this temperature difference in the thermopile of Ni-Cr or Al-Chromel pairs. The sensitivity of the heat flux sensor of Ni-Cr and Al-Chromel pairs is in the range of 0.1-2.0 and 0.4-2.0 µV mW −1 cm −2 , respectively, in the heat flux range of 0-180 mW cm −2 .

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Section: Device and Fabricationmentioning

confidence: 99%

Micro heat flux sensor using copper electroplating in SU-8 microstructures

Lee

Chun

et al. 2001

J. Micromech. Microeng.

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“…The other two approaches requires more expensive equipment and process costs, often turning the demoulding process into more complicated than electroforming itself and turning people away from using these approaches in production. Further details of stripping SU8 can be found in references [15,16]. The result on KMPR shows that it not only keeps most advantages of SU8 but also has a better dissolubility.…”

Section: Applicability In Microelectroformingmentioning

confidence: 97%

Thick photoresists for electroforming metallic microcomponents

Wei

Jiang

et al. 2008

Proceedings of the Institution of Mechanical Engineers, Part C:

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Recently, microelectroforming has been extensively applied to fabricating metallic components for sensors, actuators, and other systems. Thick photoresists are used for making micromoulds for electroforming and closely related to the quality and costs of an electroforming process. In the current paper, thick UV photoresists SU8, BPR100, and KMPR are analysed and compared in their electroforming performance of nickel microcomponents. Optimized UV lithography processes are introduced for producing micromoulds in each of the resists and scanning electron microscope (SEM) images of the moulds are presented and analysed. Then, electroformed nickel components from the micromoulds are presented. Finally, applicability of the photoresists to electroforming microcomponents is discussed. Each of the resists demonstrates advantages and disadvantages to suit different applications.

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“…Generally, the mold structure is fabricated from photolithographic procedures such as silicon bulk micromachining or surface micromachining employing high-aspect-ratio resists such as SU-8 [ 16 ]. In the typical conventional procedure for preparing the mold, a silicon or SU-8 photoresist structured primary mold is treated with a conductive layer on the surface, and then electroforming is performed in a galvanic bath to form the secondary mold.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of a Metal Micro Mold by Using Pulse Micro Electroforming

Chen

Liu

et al. 2018

Micromachines

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Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its unique characteristics, polymethyl methacrylate (PMMA) show great potential in fabricating microfluidic devices. Hot embossing technology has established itself as a popular method of preparing polymer microfluidic devices in both academia and industry. However, the fabrication of the mold used in hot embossing is time-consuming in general and often impractical for economically efficient prototyping. This paper proposes a modified technology for preparing metal micro molds by using pulse micro electroforming directly on metallic substrate, which could save time and reduce costs. In this method, an additive was used to avoid surface defect on deposited nickel. A chemical etching process was performed on the metallic substrate before the electroforming process in order to improve the bonding strength between the deposited structure and substrate. Finally, with the aim of obtaining a metal micro mold with high surface quality (low surface roughness), an orthogonal experiment was designed and conducted to optimize the electroforming parameters. Additionally, metal micro molds with different structures were well prepared by using the optimized parameters.

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Electroplated compliant metal microactuators with small feature sizes using a removable SU-8 mould

Cited by 10 publications

References 1 publication

Micro heat flux sensor using copper electroplating in SU-8 microstructures

Micro heat flux sensor using copper electroplating in SU-8 microstructures

Thick photoresists for electroforming metallic microcomponents

Fabrication of a Metal Micro Mold by Using Pulse Micro Electroforming

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