Electroplated solder joints for flip-chip applications

Yung, E.K.N.; Turlik, I.

doi:10.1109/33.83943

Cited by 52 publications

(14 citation statements)

References 12 publications

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“…In the same timeframe, lower cost bumping processes were being developed at Unitive, Inc. (spin out of the Microelectronics Center of NC) [11][12] and FCT (Flip Chip Technologies), the joint venture of Delco and K&S [13]. Their developments of lower cost UBMs (FCT -Al/Ni-V/ Cu; Unitive -Ti/Cu/Ni) and solder deposition technologies (FCT -stencil printing; Unitive -plating), and use of repassivation and redistribution, in combination with…”

Section: A Historical Look At Flip Chip Evolutionmentioning

confidence: 99%

3D and MEMS Packaging

2011

Advancing Microelectronics Magazine

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On the Cover: Pressure distribution over the bottom side of the substrate and its bond pads (as imaged by Topaq Analysis System) IMAPS -International Microelectronics AndPackaging Society 611 2nd Street, NE Washington, DC 20002 Tel: (202) Inside Back Cover Calendar of Events U P C O M I N G E V E N T S F R O M T H E P R E S I D E N T President's MessageMy deepest sympathy and condolence to the Japanese people affected by the recent earthquake and the aftermath that followed. They are in our thoughts and prayers. I have just returned from the International Conference on Electronic Packaging held in Nara, Japan. We have a special bond with the Japanese people because of the common professional interest in microelectronics and electronic packaging industries. Many electronic companies have been directly hit by this disaster.We just had a successful Device Packaging Conference (DPC) in Scottsdale. This conference had leading-edge papers on topics like 3D, wafer-level packaging and fl ipchip technologies. The exhibition had the mix of equipment, materials suppliers and service providers for the technologies relating to conference topics. I have to give kudos to Dr. Phil Garrou and his technical chairs, who did an excellent job of making it happen.The upcoming ATW on High Reliability Microelectronics for Military Applications will address some of these issues. This event will be held on May 17-19, 2011, Holiday Inn Baltimore-BWI International Airport (soon to be the Doubletree BWI -March 2011), Maryland. Greg Caswell and his team have put together an excellent program, another example of great professional volunteerism.As IMAPS President, I am fi nding out that key to a successful event are the general chairs and technical chairs.Our society needs talented and passionate members to organize successful events like DPC. I am requesting of all IMAPS members that if you or someone you know has a passion and talent to hold one of the IMAPS technical events, we need you badly. Please contact me, IMAPS Executive Council Members, or the IMAPS Director or staff to further discuss your ideas on a technical event, which could be a webinar, Advanced Technology Workshop or a conference.So please think what you could achieve if you and a few of your IMAPS friends put your heads together in organizing an event. Volunteer and you will fi nd more rewards than you expected.The focus of this issue is 3D and MEMS Packaging. Today, 3D packaging is the topic of discussion at several packaging conferences including DPC. 3D packaging will enable miniaturization of electronics as never achieved before. Companies are exploring technologies ranging from simple 3D stacking of packages to 3D stacking of ICs using thru-silicon-vias. The infrastructure to fabricate 3D electronics, which was non-existent just a few years ago, is becoming more available. The key to the success of both 3D packaging and MEMS packaging will be low cost and higher functional densities. I hope you enjoy reading the articles on these topics in this issue. Long Beach...

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Section: A Historical Look At Flip Chip Evolutionmentioning

confidence: 99%

3D and MEMS Packaging

2011

Advancing Microelectronics Magazine

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“…The flip-chip technologies include several mounting methods currently in use such as anisotropic conductive film/paste (ACF/ACP), controlled collapse chip connection (C4), stud bump bonding (SBB). 1,2) Among these flip-chip technologies, SBB is frequently used in a prototype development because of low cost and easy application without under bump metallurgy (UBM). In particular, the flip chip technology used for Au-Sn that includes the thermo-compression bonding process is actively studied because of high frequency characteristic of Au-Sn solder, 3) but considered the efficient transmission of optical signal, flip-chip using thermo-compression bonding process is limited because of the alignment of optical signal.…”

Section: Introductionmentioning

confidence: 99%

Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages

Kim

Yang

2003

Mater. Trans.

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The shear strength and fracture surfaces of Sn-Pb bump and Au stud bump for photodiode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass%Pb solders were adopted, and aged at 373 K and 423 K for up to 900 hours to analyze the effect of intermetallic compound (IMC). The shear strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallopshaped IMCs, and planar-shape Cu 3 Sn were observed by transmission electron microscopy (TEM). The formation of Kirkendall voids with the growth of IMCs at the solder was found to be a possible mechanism for shear strength reduction. IMCs between Au stud bumps and Al pads were identified as AlAu 2 .

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“…As the package become smaller, it is necessary to investigate the reliability of the fine joint area. 2,3) The intermetallic compound (IMC), grows at the solder and at the under bump metallurgy (UBM) interface at the practical operating temperature during the reflow process and eventually forms the solder bump. The IMC at the interface of the solder and the UBM causes cracks at the solder joint area owing to brittleness, and weakens the overall joint strength.…”

Section: Introductionmentioning

confidence: 99%

Aging Treatment Characteristics of Shear Strength in Micro Solder Bump

Kim

Sun

et al. 2002

Mater. Trans.

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The shear strength of the Cr/Cr-Cu/Cu UBM structure in both the high-melting solder bump and low-melting solder bump after aging were evaluated. SEM and TEM were examined in the intermetallic compounds and bump joint profiles at the interface between solder and UBM. The shear load concentrated on the bump was analyzed by finite element method. In 900-hour aging experiments, the maximum shear strength of Sn-97 mass%Pb and Sn-37 mass%Pb decreased by 25% and 20%, respectively. The growth of Cu 6 Sn 5 and Cu 3 Sn was ascertained by the aging treatment. The crack path changes from the interior of a solder to the intermetallic compound interface was evaluated. Compared with the Cu-Sn IMC, the amount of Ni-Sn IMC was small. The Ni layer is considered as the diffusion barrier.

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Electroplated solder joints for flip-chip applications

Cited by 52 publications

References 12 publications

3D and MEMS Packaging

3D and MEMS Packaging

Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages

Aging Treatment Characteristics of Shear Strength in Micro Solder Bump

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