Wearable and implantable devices utilize flexible circuit boards for tracking biological movements and tissue structures [1,2]. Previous studies have proposed various methods for fabricating flexible substrates, and the most commonly used methods are thin-film processes based on MEMS processes [3,4] and direct drawing processes using inkjet [5][6][7] or screen printing [8,9]. The fabricated flexible substrate offers high flexibility and allows the addition of elasticity [10]. Moreover, these methods enable fabrication of interlayer connection shapes for integration, making them applicable to various devices [4,11,12]. However, substrates created by these methods have durability issues against long-term mechanical stress and electric field corrosion when implanted in the body. Additionally, in implantable devices, the available power is limited due to factors such as device size and power transmission efficiency. Therefore, high wiring resistance is also a concern. To achieve low resistance in thin-film processes, the wiring width is widened to avoid self-destruction due to internal stress. Unfortunately, this approach inevitably leads to larger devices. Although formation of thick films with printing technology is possible, depending on the selection of materials [9], a thick film in either method degrades mechanical properties and increases the risk of wire breakage during shape changes.