Electroplating as an Innovative Joining Method for Laser Additive Manufactured Components Made of AlSi10Mg

Rudolph, Kris; Noack, Marco; Hausmann, Maximilian; Kirchner, Eckhard; Babaei, Pedram

doi:10.1007/978-3-031-05918-6_11

Cited by 2 publications

(2 citation statements)

References 26 publications

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“…In addition, the joining process is, to some extent, independent of the geometry of the joining zone, since the material is deposited on all non-insulated areas exposed to the electrolyte and no further auxiliary tools are required. However, the edges of the joining zone are exposed to a higher current intensity than in the center of the joining zone, resulting in higher material deposition at the edge [14][15][16]. Rudolph et al investigated the influence of V-shaped joining zone geometry on layer formation during the electrochemical joining of additively manufactured specimens made of AlSi10Mg by the L-PBF process.…”

Section: Introductionmentioning

confidence: 99%

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Influence of Sheet Covers on Filling Behavior in Electrochemical Joining of Additively Manufactured Components

Noack,

Rudolph,

Breimann

et al. 2023

JMMP

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This paper focuses on the electrochemical joining of additively manufactured components using simulation-based and experimental methods. The study investigates the influence of cover screens on the filling behavior of the joining zone. Experimental methods involving additive manufacturing and electroplating are combined with simulation models to provide a realistic representation of the joining process. The results show a good agreement between the simulated and experimental findings, indicating the applicability of the simulation model. The parameter study reveals that higher cover factors result in a decrease in the excess material ratio, indicating reduced material deposition outside the joining zone. The filling time required to completely fill the joining zone is influenced by both the cover size and the opening angle of the joining zone. The optimal parameter combinations depend on whether the filling time or the excess material volume is to be minimized. Cavity formation within the joining zone was identified as a critical factor affecting the completeness of the filling. The study provides insights into the influence of cover screens on the electrochemical joining process and offers guidance for optimizing the design of the joining zone.

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Section: Introductionmentioning

confidence: 99%

“…The tensile strength for specimens joined with nickel is 127.4 MPa and for specimens joined with copper is 83.2 MPa. The causes of failure include delamination in the zinc layer, which is necessary as an intermediate layer for the electroplating of aluminum base materials [14].…”

Section: Introductionmentioning

confidence: 99%