Electroplating Engineering Handbook

Graham, A. Kenneth; Sternfels, Martin M.

doi:10.1149/1.2430182

Cited by 9 publications

(19 citation statements)

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“…3 The data from this study confirm the low emissions from nickel sulfate (Watts) baths and show equally low emissions from nickel sulfamate baths.…”

Section: Copper Platingsupporting

confidence: 74%

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NIOSH technical report: control technology assessment: metal plating and cleaning operations.

1984

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A control technology assessment of electroplating and cleaning operations was conducted by the National Institute for Occupational Safety and Health (NIOSH).Walk-through surveys were conducted at about 30 electroplating plants and 9 in-depth studies at 8 plants. Air sampling and ventilation data and other control information were collected for 64 plating and cleaning tanks.Thirty-one of these were hard chrome plating tanks but cadmium, copper, nickel, silver, and zinc plating tanks were also evaluated.Acid, caustic and solvent cleaning tanks were also evaluated. Worker exposures were found to be controlled below existing and recommended standards. i11

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“…3 The data from this study confirm the low emissions from nickel sulfate (Watts) baths and show equally low emissions from nickel sulfamate baths.…”

Section: Copper Platingsupporting

confidence: 74%

“…2 In the case of electroless plating the barrels can be constructed from "Lucite", or polypropylene because no electrical connections are required. 3 The manual or vat process incorporates a series of tanks that contain the appropriate cleaning and plating solutions.…”

Section: Mechanical Processesmentioning

confidence: 99%

NIOSH technical report: control technology assessment: metal plating and cleaning operations.

1984

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“…7 It is evident that ammoniacal platting baths produce the desirable bottom-up or super filling behavior in trenches and vias. 8 In previous studies, [8][9][10] it has been shown that a composition of ammonia, copper sulfate, and ammonium sulfate is successful in copper plating. However, the same chemistry is found to be too corrosive for the W 2 N and it dissolves "Seedless" Electrochemical Deposition of Copper on Physical Vapor Deposition-W 2 N Liner Materials for ULSI Devices 1603 the barrier before full copper coverage can be obtained.…”

Section: Resultsmentioning

confidence: 99%

“Seedless” electrochemical deposition of copper on physical vapor deposition-W2N liner materials for ultra large scale integration (ULSI) devices

Shaw

Grunow

Duquette

2001

Journal of Elec Materi

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Electrochemical studies are designed to identify processes that provide adequate nucleation and thin film growth directly on ultrathin, air-exposed physical vapor deposition (PVD)-tungsten nitride diffusion barriers. In this study, it is shown that very thin copper films can be nucleated directly on a conducting PVD-W 2 N liner surface. A complex chemistry model based on mass balance and thermodynamic equilibrium has been applied to numerous ammoniacal platting bath compositions and the resulting concentration profiles inserted into the Nernst equation. Comparing the experimental results with the predicted model indicates that a strong adhesion is associated with the reduction of several copper-ammonia complexes at the metal nitride surface. Nucleation, growth mechanisms, and film resistivity are found to be dependent on the reduction potential, electrolyte velocity, and platting bath chemistry.

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“…Each needle was then manually bent at 90° out of the plane of the sheet. The needles were electropolished in a bath containing a 6:3:1 mixture by volume of glycerin, phosphoric acid, and water (Fisher Scientific, Atlanta, GA, USA) to remove debris (Graham 1971;Hensel, 2000). This electropolishing process reduced the needle thickness to 50 m.…”

Section: Microneedle Fabricationmentioning

confidence: 99%

Inkjet printing of transdermal microneedles for the delivery of anticancer agents

Uddin

Scoutaris

Klepetsanis

et al. 2015

International Journal of Pharmaceutics

160

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A novel inkjet printing technology is introduced as a process to coat metal microneedle arrays with three anticancer agents 5-fluororacil, curcumin and cisplatin for transdermal delivery. The hydrophilic graft copolymer Soluplus® was used as a drug carrier and the coating formulations consisted of drug -polymer solutions at various ratios. A piezoelectric dispenser jetted microdroplets on the microneedle surface to develop uniform, accurate and reproducible coating layers without any material losses. Inkjet printing was found to depend on the nozzle size, the applied voltage (mV) and the duration of the pulse (s). The drug release rates were determined in vitro using Franz type diffusion cells with dermatomed porcine skin. The drug release rates depended on the drug-polymer ratio, the drug lipophilicity and the skin thickness. All drugs presented increased release profiles (750 m skin thickness), which were retarded for 900 m skin thickness. Soluplus assisted the drug release especially for the water insoluble curcumin and cisplatin due to its solubilizing capacity. Inkjet printing was proved an effective technology for coating of metal microneedles which can then be used for further transdermal drug delivery applications.

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Electroplating Engineering Handbook

Cited by 9 publications

References 0 publications

NIOSH technical report: control technology assessment: metal plating and cleaning operations.

NIOSH technical report: control technology assessment: metal plating and cleaning operations.

“Seedless” electrochemical deposition of copper on physical vapor deposition-W2N liner materials for ultra large scale integration (ULSI) devices

Inkjet printing of transdermal microneedles for the delivery of anticancer agents

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