2021
DOI: 10.1142/s1793604721510231
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Electroplating of copper/microdiamond composites and the effect of diamond surface functionalization

Abstract: Compositing diamonds with high thermally conductive metals, such as copper, have attracted much attention in recent years. In this study, we prepared copper/diamond composites by electroplating and investigated the effect of the surface functionalization of diamond on the interfacial adhesion of copper and diamond in the composite. Oxygen-containing groups were introduced on the diamond surface by a hydrothermal treatment and amino groups were further introduced using a silane coupling agent. Surface functiona… Show more

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