Electroplating of Electronic Materials for Applications in Large Area Electronics: A Review

Abstract

The attributes of electroplating as a low-cost, simple, scalable and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition are buttressed experimentally using techniques such as X-ray diffraction, Ultraviolet-visible spectroscopy, Scanning electron microscopy, Atomic force microscopy, Energy-dispersive X-ray spectroscopy and photoelectrochemical cell studies. Based on the structural, morphological, compositional optical, and electronic properties evaluated results, it is evident that electroplating possesses the capabilities of producing high-quality semiconductors usable in producing excellent devices. In this paper, we will describe the progress of electroplating technique mainly for the deposition of semiconductor thin film materials, their treatment processes and fabrication of solar cells.

Gallium Nitride Electrodeposition at Indium Tin Oxide and Fluorine Tin Oxide Electrodes in Ammonium Nitrate and Gallium Nitrate Aqueous Solution

“…Electrodeposition is a well-known technique at industrial level since it is effortless to achieve it in metals and metallic alloys. Indeed, it has been done since the late 1960's and the electrodeposition of compound semiconductors has been boosted through the years (8). The search for an effective technique has led to the discovery of potentiostatic electrochemical deposition (PECD) as a suitable method for GaN synthesis (9).…”