Electrostatic Capacity Type Micro Inclination Sensor Utilizing Dielectric Nano-Particles

Ueda, Hiroyasu; Ueno, Hiroshi; Itoigawa, K.; Hattori, Tadashi

doi:10.1109/mhs.2006.320258

Cited by 7 publications

(2 citation statements)

References 5 publications

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“…Figure 1 shows the working principle of the micro-capacitive inclination sensor [5,6,7] fabricated in this study. Two opposing semicircular electrodes are set above one circular common electrode, as shown in Figs.…”

Section: Micro-capacitive Inclination Sensormentioning

confidence: 99%

Fabrication of Micro-Capacitive Inclination Sensor Using the LIGA Process

Kuboyama

Nishida²,

Noda

et al. 2012

KEM

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The resource saving of various electronic devices and advancement are demanded. Research and development of the MEMS device are briskly done from viewpoints of a miniaturization and highly-efficient. However, tip-shaped device manufacture is easy by the MEMS, but is hard to manufacture the tertiary structure. Therefore, as nanofabrication technology aiming at the mass production of the tertiary structure, LIGA process to make a microstructure body by copying it attracts attention of resin. In this research, the electric capacity type inclination sensor which used the LIGA process is produced. By using resin molding for a manufacturing step, a production cost can be low held down compared with the existing sensor. Former, the silicon mold which has a pattern of the size of 7×7 mm and structure height 100µm using ICP dry etching was produced. In addition, we performed resin molding using the silicon mold and succeeded in the manufacture and evaluation of the angle of inclination sensor. We expect that if techniques using resin-molded parts are introduced to the low-cost mass-production of MEMS devices (including sensors), the range of applications will further expand to new areas of technology and industry.

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Section: Micro-capacitive Inclination Sensormentioning

confidence: 99%

Fabrication of Micro-Capacitive Inclination Sensor Using the LIGA Process

Kuboyama

Nishida²,

Noda

et al. 2012

KEM

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“…Our research focused on a direct jointing technology that employs hydrogen bonding [1] [2] . In this technology, OH radicals are absorbed into the surface of the material to be bonded by modifying its surface properties by ion irradiation [3] .…”

Section: Introductionmentioning

confidence: 99%

Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion

Nishimoto

Ishizawa

Ueda

et al. 2008

JAMDSM

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Reliable joining technologies are essential for fabrication of microstructures such as micro-machines, and particularly technologies that are capable of jointing different types of materials. However, these technologies cannot be used for materials that have different rates of thermal expansion or in cases where the adhesives have an effect on the properties of the component materials. Our research focused on developing a direct jointing technology which employs hydrogen bonding. In this technology, OH radicals are absorbed into the surface of the material to be bonded by modifying its surface properties by ion irradiation. We studied the modification of the surface properties of two resins, (SU-8 and PMMA) by H 2 O ion irradiation and Ar cleaning. It was confirmed that the presence of H 2 O ions on the surface of these resins improved their hydrophilic properties and also the peel strengths of Cu membrane s deposited onto both resins. Based on the results of these studies, a series of experiments were conducted in which two different materials, (copper plus one or other of the resins) were joined directly and the results were evaluated. Each of the resins could be joined to copper by heating to a temperature of 100 °C and pressurizing to 10 MPa. This jointing technology will now be applied to the fabrication of the tilt sensors that we are currently developing.

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Micro Capacitive Tilt Sensor for Human Body Movement Detection

Zhao

Yeatman

4th International Workshop on Wearable and Implantable Body Sensor Networks (BSN 2007)

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Abstract-Tilt sensing is important for human body motion detection and measurement. Two tilt sensors are introduced in this paper, based on MEMS (Micro-electromechanical Systems) variable capacitors, and utilizing the gravitational effect on a suspended proof mass to detect inclinations. A symmetric comb structure with high aspect ratio is adopted to obtain high capacitance. The first device can achieve a full range (-90° to +90°) tilt angle detection and relax the high-resolution requirement of the readout system by its linear output characteristics. Based on the same concept, a novel inherently digital sensor is proposed. The digital signal can be read out without complex processing, and so low power consumption can be achieved. A fabrication process, and simulation and processing results, are presented.

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Electrostatic Capacity Type Micro Inclination Sensor Utilizing Dielectric Nano-Particles

Abstract: We have developed a capacitive inclination sensor 5 mmx 5 mm x 1.5 mm in size, with a linear analog output.

Cited by 7 publications

References 5 publications

Fabrication of Micro-Capacitive Inclination Sensor Using the LIGA Process

Fabrication of Micro-Capacitive Inclination Sensor Using the LIGA Process

Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion

Micro Capacitive Tilt Sensor for Human Body Movement Detection

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