1998
DOI: 10.1109/5.659493
|View full text |Cite
|
Sign up to set email alerts
|

Electrostatic discharge in semiconductor devices: an overview

Abstract: Electrostatic discharge (ESD) is an event that sends current through an integrated circuit (IC). This paper reviews the impact of ESD on the IC industry and details the four stages of an ESD event: 1) charge generation, 2) charge transfer, 3) device response, and 4) device failure. Topics reviewed are charge generation mechanisms, models for ESD charge transfer, electrical conduction mechanisms, and device damage mechanisms leading to circuit failure.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
54
0
1

Year Published

2003
2003
2024
2024

Publication Types

Select...
5
3
1

Relationship

0
9

Authors

Journals

citations
Cited by 126 publications
(55 citation statements)
references
References 50 publications
0
54
0
1
Order By: Relevance
“…There is a need for ESD prevention and design of ESD immune electronics. Lot of effort has gone into the study of ESD current waveforms in order to develop discharge simulators for simplifying and standardizing ESD susceptibility testing [1, 2,3]. The radiated fields associated with ESD events [4] have received much less attention compared to conducted susceptibility [5,6].…”
Section: Introductionmentioning
confidence: 99%
“…There is a need for ESD prevention and design of ESD immune electronics. Lot of effort has gone into the study of ESD current waveforms in order to develop discharge simulators for simplifying and standardizing ESD susceptibility testing [1, 2,3]. The radiated fields associated with ESD events [4] have received much less attention compared to conducted susceptibility [5,6].…”
Section: Introductionmentioning
confidence: 99%
“…Generally, human bodies and machine components are charged by walking across a carpeted floor or removing a sweater, and by rubbing insulative materials during their operation, respectively. 17) Meanwhile, IEC61000-4-2 and IEC61000-4-4 are part of a larger family of IEC 61000-4 (IEC: International Electrotechnical Commission) defined as the performance required of all electronic devices in a variety of electromagnetic interference (EMI) conditions. The IEC was developed from HBM, which is referred as the minimum ESD level of acceptable performance required on all electronic devices sold into the European Union.…”
Section: ¹4mentioning
confidence: 99%
“…Among semiconductor product failures, more than 50% of them are caused by ESD and overvoltage. In the case of static discharge, electric charge transfer happens instantly and results in dielectric breakdown or metallization melt within semiconductor device from discharged voltage and induced current [3]. Figure 1 illustrates common failure of integrated circuit, and Table 1 shows ESD susceptibility of various electronic devices.…”
Section: Introductionmentioning
confidence: 99%