2013
DOI: 10.1109/jstqe.2013.2250259
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Electrothermal Finite-Element Modeling for Defect Characterization in Thin-Film Silicon Solar Modules

Abstract: Abstract-We present and validate a finite-element model for coupled charge and heat transport in monolithically interconnected thin-film solar modules. Using measured current-voltage (I-V) and lock-in thermography (LIT) measurements of amorphous silicon minimodules, we experimentally validate our model. The entire module volume is represented by two planes (front and back electrodes) which are coupled in vertical direction using 1-D models, leading to a large reduction of the degrees of freedom in the numerica… Show more

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Cited by 15 publications
(7 citation statements)
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“…5) Given the device structure, thermal runaway and its related hot spots can be numerically modeled thus allowing hot spot free device engineering. Numerical algorithm developed in this work or other algorithms 17 can be used provided that they do not impose the often assumed restriction of device uniformity in the course of modeling. 6) Radiative cooling can be an important factor limiting the hot spot size and other parameters.…”
Section: Discussionmentioning
confidence: 99%
“…5) Given the device structure, thermal runaway and its related hot spots can be numerically modeled thus allowing hot spot free device engineering. Numerical algorithm developed in this work or other algorithms 17 can be used provided that they do not impose the often assumed restriction of device uniformity in the course of modeling. 6) Radiative cooling can be an important factor limiting the hot spot size and other parameters.…”
Section: Discussionmentioning
confidence: 99%
“…In this section, the modelling approach is described. This model can also be applied to large‐area OLED lighting or solar cells …”
Section: Modelling Approachmentioning
confidence: 99%
“…The entire display is at least cm 2 size (even for micro‐displays). The 2 + 1D FEM approach was previously applied to amorphous Si solar cells by Lanz . The advantage of our approach is that the number of degrees of freedom is greatly reduced compared with 3D FEM methods.…”
Section: Introductionmentioning
confidence: 99%
“…Figure 8 shows the model that is based on a 2+1D approach where the 1D model represents the micro-scale semiconductor device model P-151L / S. Altazin Late-News Poster described in the first part of this paper coupled to a 2D Ohmic conduction model for the large-area electrodes. As the microscopic density of current flowing in the vertical direction strongly depends on the electrical potential boundary condition and as the current flowing in the large area strongly affect the potential distribution (due to Ohm's law), the 1D charge transport and the 2D current flow equation have to be solved self-consistently [11]. The 2+1D model can be applied to study the influence of shunts ( Figure 9) and conductivity-enhancing metal grid on the OLED with an area of 225 cm 2 (Figure 10).…”
Section: Electrical Model For the Macro-scale Approachmentioning
confidence: 99%