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Electrothermal heating generated via radio frequency (RF) fields is used to probe the transformation of phenolic resin to a carbon matrix during pyrolysis. Phenolic resin is a single‐stage thermoset that is popular due to its heat resistance, chemical resistance, high strength, and low creep properties. When phenolic resin is subjected to high‐temperature, low‐oxygen treatment (pyrolysis), it is converted to a carbon material useful for many structural applications. Here, neat phenolic resin is pyrolyzed at different temperatures, and the heating response of the newly formed carbon material is tracked when exposed to an RF field. The electrical conductivity of the matrix increased with increasing pyrolysis temperature, with ≈10−4 S m−1 for the neat sample prior to pyrolysis, and ≈102 S m−1 for the sample pyrolyzed at 850 °C. The material's electrothermal response to applied RF fields increases as the material pyrolyzes and becomes conductive; however, at high pyrolysis temperatures, the material becomes sufficiently conductive such that the RF fields are reflected rather than absorbed, and the heating response decreases. The findings of this work show that heating response to RF fields can be used as a quick and easy characterization technique for tracking structural changes associated with phenolic pyrolysis.
Electrothermal heating generated via radio frequency (RF) fields is used to probe the transformation of phenolic resin to a carbon matrix during pyrolysis. Phenolic resin is a single‐stage thermoset that is popular due to its heat resistance, chemical resistance, high strength, and low creep properties. When phenolic resin is subjected to high‐temperature, low‐oxygen treatment (pyrolysis), it is converted to a carbon material useful for many structural applications. Here, neat phenolic resin is pyrolyzed at different temperatures, and the heating response of the newly formed carbon material is tracked when exposed to an RF field. The electrical conductivity of the matrix increased with increasing pyrolysis temperature, with ≈10−4 S m−1 for the neat sample prior to pyrolysis, and ≈102 S m−1 for the sample pyrolyzed at 850 °C. The material's electrothermal response to applied RF fields increases as the material pyrolyzes and becomes conductive; however, at high pyrolysis temperatures, the material becomes sufficiently conductive such that the RF fields are reflected rather than absorbed, and the heating response decreases. The findings of this work show that heating response to RF fields can be used as a quick and easy characterization technique for tracking structural changes associated with phenolic pyrolysis.
This review paper delves into the manufacturing methods, material properties, and applications of polymer‐based composites in the field of advanced manufacturing, offering a detailed explanation of their production through various additive manufacturing (AM) techniques and their diverse applications across multiple industries. Polymer‐based composite materials have emerged as crucial elements in AM due to their enhanced properties and design versatility, enabling the creation of components with unprecedented performance characteristics. The paper comprehensively covers the major AM methods employed for composite materials, including fused filament fabrication, Digital Light Processing/Stereolithography, Direct Ink Writing, and Selective Laser Sintering. Each of these methods is explored in terms of its mechanism, suitability for different composite materials, and the resulting material properties. The review also provides an insightful analysis of how these AM techniques are revolutionizing industries such as soft robotics, mechanical, electrical, and biomedical fields. The paper concludes by discussing the current challenges in this domain and projecting future trends in the development and application of composite materials in advanced manufacturing. This review aims to offer a comprehensive resource for researchers and practitioners in the field, highlighting the transformative impact of polymer‐based composites in AM and their growing significance across various sectors.Highlights Comprehensive review and classification of novelties in printing method for polymer based composite material manufacturing. Introduces innovative techniques to create and enhance material properties of composites. Explores interdisciplinary applications in biomedical, electronics, and sensors, demonstrating material versatility. Provides a systematic correlation between manufacturing method, material properties, and applications of novel polymer‐based composites.
Here we demonstrate direct ink write (DIW) additive manufacturing of carbon nanotube (CNT)/phenolic composites with heat dissipation and excellent electromagnetic interference (EMI) shielding capabilities without curing-induced deformation. Such polymer composites are valuable for protecting electronic devices from overheating and electromagnetic interference. CNTs were used as a multifunctional nanofiller to improve electrical and thermal conductivity, printability, stability during curing, and EMI shielding performance of CNT/phenolic composites. Different CNT loadings, curing conditions, substrate types, and sample sizes were explored to minimize the negative effects of the byproducts released from the cross-linking reactions of phenolic on the printed shape integrity. At a CNT loading of 10 wt %, a slow curing cycle enables us to cure printed thin-walled CNT/phenolic composites with highly dense structures; such structures are impossible without a filler. Moreover, the electrical conductivity of the printed 10 wt % CNT/phenolic composites increased by orders of magnitude due to CNT percolation, while an improvement of 92% in thermal conductivity was achieved over the neat phenolic. EMI shielding effectiveness of the printed CNT/ phenolic composites reaches 41.6 dB at the same CNT loading, offering a shielding efficiency of 99.99%. The results indicate that high CNT loading, a slow curing cycle, flexible substrates, and one thin sample dimension are the key factors to produce highperformance 3D-printed CNT/phenolic composites to address the overheating and EMI issues of modern electronic devices.
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