ristive characteristic actually observed in a metal/oxide/metal device built with Pt and TiO 2 (5). The memristive behavior of TiO 2 is based on the presence of oxygen vacancies moving forward and backward across the electronic barrier at the metal/ oxide interface, generally through the formation of an oxygen vacancy filament, which results in changes to oxide resistance (6-9). The existence of such a filament has already been proved both experimentally by applying microscopy-based techniques, and through modeling (10-14). This research study presents the technique of anodic oxidation as a means to produce metal oxides with added functionalities, specifically a memristive behavior, with a special focus on titanium, niobium and tantalum oxides (15). This technique can lead to the controlled production of oxide films on valve metals, and to the tuning of growth kinetics and oxide properties as a function of process parameters. Controlling electrochemical parameters (cell voltage, electrolyte composition, anodizing time) defines the oxide thickness, morphology, chemical and structural composition (15-17), which in turn is responsible for titanium surface properties such as corrosion resistance, insulation or biocompatibility (18, 19). Anodizing is a cheap, room-temperature alternative to physical and chemical fabrication methods typical of the electronics industry that are currently applied to memristor production. Furthermore, anodizing has already been demonstrated as suitable for producing memristive TiO 2 films (11, 20).