flux of Cu. Due to the ripening flux, the Cu 6 Sn 5 grains with small radius tend to be dissolved, while those with large radius keep growing with scallop-like smooth surfaces, resulting in the annexation between neighboring grains. In our previous study, the annexation behavior of the scallop-like Cu 6 Sn 5 grains at the Sn/Cu liquid-solid interface was in situ observed by using synchrotron radiation real-time imaging technology, which first proved the validity of the FDR theory experimentally. [6] In electronic packaging technology, reflow soldering or thermal-compression bonding is applied to achieve the liquidsolid interface reactions between Sn-based solders and Cu pads or bumps. During soldering or bonding, metallurgical reactions occur to generate interfacial IMCs which become the bridge connecting the solders and the pads or bumps, thereby realizing the electrical and mechanical interconnection of electronic components. Previous studies have shown that there are mainly the following two reactions: [7,8] C S + → 6Cu 5Sn u n 6 5(1)First, liquid solder reacts with solid Cu to generate scalloplike Cu 6 Sn 5 following Equation (1). Then the Cu 6 Sn 5 could react with the Cu to generate Cu 3 Sn layer consisting of fine grains at the Cu 6 Sn 5 /Cu interface following Equation (2). Since the IMCs formed at Sn/Cu interface have a non-cubic crystal structure, the IMC grains have a strong anisotropy along different crystal orientations. [9,10] It was revealed that the <0001> direction of Cu 6 Sn 5 tended to be perpendicular to polycrystalline Cu surface during isothermal reflow. [11][12][13] In addition to the polycrystalline Cu that is commonly used as pads or bumps with micronsized Cu grains, the Cu 6 Sn 5 generated on both single-crystal Cu [14,15] and nano-twinned Cu [16,17] substrates may show prismtype morphology and strong texture characteristics. Therefore, the Cu 6 Sn 5 texture would bring significant uncertainty to the service performance and reliability of micro interconnections.