Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips

Hu, Rui; Huang, Mengru; Lu, Linhong; Yang, Fashun; Lin, Jiexin; Ma, Kui; Ding, Zhao

doi:10.1587/elex.21.20240442

IEICE Electron. Express

2024

DOI: 10.1587/elex.21.20240442

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Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips

Rui Hu,

Mengru Huang,

Linhong Lu

et al.

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Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips

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References 30 publications

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