Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits

Erp, Remco van; Kampitsis, Georgios; Nela, Luca; Ardebili, Reza Soleimanzadeh; Matioli, Elison

doi:10.1109/itherm45881.2020.9190356

Cited by 17 publications

(6 citation statements)

References 26 publications

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“…The package level microchannels are made on a Si substrate in which the Si substrate functions as a microfluidic heat sink. Package-level cooling is capable of cooling for heat fluxes up to 500 W/cm 2 [129] while microchannels closer to the semiconductor die are effective for heat fluxes up to (a) [116], [8] (b) [117] (c) [118], [119] (d) Proposed solution Fig. 8: Combination of PCM and metals in order to have the advantages of PCM and metals at the same time.…”

Section: B Microchannel Coolingmentioning

confidence: 99%

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Bhadoria

Dijkhuizen

Raj

et al. 2023

IEEE Trans. Power Electron.

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With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technologies for the over-current performance of SiC power modules in power electronics converters. It presents the limitations produced at the power module level by packaging materials which include semiconductor chips, substrates, metallization, bonding techniques, die attach, and encapsulation materials. Specifically, technologies for over-current related temperatures in excess of 200 • C are discussed. The paper also discusses potential technologies which have been proven or may be potential candidates for improving the safe operating area. The discussed technologies are use of phase change materials below the semiconductor chip, Peltier elements, new layouts of the power modules, control and modulation techniques for converters. Special attention has been given to an overview of various potential phase change materials which can be considered for high-temperature operations.

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Section: B Microchannel Coolingmentioning

confidence: 99%

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Bhadoria

Dijkhuizen

Raj

et al. 2023

IEEE Trans. Power Electron.

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“…Therefore, a multitude of researchers have investigated methods to increase the lifetime by reducing (the swing of) the junction temperature. One tested method is the introduction of microchannels below the chip [13]. Microchannels have shown to be effective in reducing the junction temperature by 60 • C with just 0.83 mL/s of water flowing in the microchannels below the chip for a heat flux of 500 W/cm 2 .…”

Section: Introductionmentioning

confidence: 99%

Over-Current Capability of Silicon Carbide and Silicon Devices for Short Power Pulses with Copper and Phase Change Materials below the Chip

Bhadoria,

Dijkhuizen,

Zhang

et al. 2024

Energies

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An increasing share of fluctuating and intermittent renewable energy sources can cause over-currents (OCs) in the power system. The heat generated during OCs increases the junction temperature of semiconductor devices and could even lead to thermal runaway if thermal limits are reached. In order to keep the junction temperature within the thermal limit of the semiconductor, the power module structure with heat-absorbing material below the chip is investigated through COMSOL Multiphysics simulations. The upper limits of the junction temperature for Silicon (Si) and Silicon Carbide (SiC) are assumed to be 175 and 250 ∘C, respectively. The heat-absorbing materials considered for analysis are a copper block and a copper block with phase change materials (PCMs). Two times, three times, and four times of OCs would be discussed for durations of a few hundred milliseconds and seconds. This article also discusses the thermal performance of a copper block and a copper block with PCMs. PCMs used for Si and SiC are LM108 and Lithium, respectively. It is concluded that the copper block just below the semiconductor chip would enable OC capability in Si and SiC devices and would be more convenient to manufacture as compared to the copper block with PCM.

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“…Remco van Erp [ 14 , 15 ] proposed a new thermal management method for liquid-cooled GaN-based power integrated circuits embedded directly in Si substrates, with PCBs as the delivery platform. The performance coefficient of a manifold thermal structure etched into the Si substrate is increased by a factor of 50 over that of a straight microchannel.…”

Section: Introductionmentioning

confidence: 99%

A Novel Swept-Back Fishnet-Embedded Microchannel Topology

Wang,

Zhang,

Yang

et al. 2023

Micromachines

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High in reliability, multi in function, and strong in tracking and detecting, active phased array antennas have been widely applied in radar systems. Heat dissipation is a major technological barrier preventing the realization of next-generation high-performance phased array antennas. As a result of the advancement of miniaturization and the integration of microelectronics technology, the study and development of embedded direct cooling or heat dissipation has significantly enhanced the heat dissipation effect. In this paper, a novel swept-back fishnet-embedded microchannel topology (SBFEMCT) is designed, and various microchannel models with different fishnet runner mesh density ratios and different fishnet runner layers are established to characterize the chip Tmax, runner Pmax, and Vmax and analyze the thermal effect of SBFEMCT under these two operating conditions. The Pmax is reduced to 72.37% and 57.12% of the original at mesh density ratios of 0.5, 0.25, and 0.125, respectively. The maximum temperature reduction figures are average with little change in maximum velocity and a small increase in maximum pressure drop across the number of fishnet runner layers from 0 to 4. This paper provides a study of the latest embedded thermal dissipation from the dimension of a single chip to provide a certain degree of new ideas and references for solving the thermal technology bottleneck of next-generation high-performance phased array antennas.

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Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits

Cited by 17 publications

References 26 publications

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Over-Current Capability of Silicon Carbide and Silicon Devices for Short Power Pulses with Copper and Phase Change Materials below the Chip

A Novel Swept-Back Fishnet-Embedded Microchannel Topology

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