Embedded Trench Redistribution Layers at 2– $5~\mu \text{m}$ Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20– $40~\mu \text{m}$ I/O Pitch Interposers

Suzuki, Yuya; Hichri, Habib; Wei, Frank; Tummala, Rao

doi:10.1109/tcpmt.2017.2676023

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Embedded Trench Redistribution Layers at 2– $5~\mu \text{m}$ Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20– $40~\mu \text{m}$ I/O Pitch Interposers

Cited by 5 publications

References 22 publications

Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging

Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging

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Ultra-Fine Pitch Interconnects using a Novel Lift-off based Process of Thick Copper Films on Organic Substrate for Advanced Packaging

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