Embedded wafer level ball grid array (eWLB) technology for high-frequency system-in-package applications

Abstract

The embedded wafer level ball grid array (eWLB) is a novel system integration platform introduced recently. The eWLB technology is an attractive solution for high-frequency system-in-package (SiP) integration due to the capability to design high-quality (high-Q) embedded passives in the fan-out region and side-by-side multichip integration possibilities. In this paper, we show examples of using the fan-out region and the thinfilm redistribution layer (RDL) advantageous for integration of inductors and antennas into an eWLB package. In addition, the use of the through encapsulant via (TEV) technology can extend the integration capabilities to 3D. We present measurement and simulation results of vertical interconnections realized using the RDL and TEVs of the eWLB. We demonstrate that the fanout area of the eWLB can be used for the design of passive devices using the combination of TEV and RDL structures. We show examples of 3D inductors and transformers integrated in the eWLB. We present a fully integrated single-chip 60-GHz transceiver integrated in the eWLB package together with two dipole antennas as an example of mm-wave system integration.

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

“…Most of the chip-on-board, flip-chip, and 3D through silicon via (TSV) research that exists in the literature is targeted toward low power microelectronics or sensor applications [39][40][41][42][43][44]. Low power RF circuits have also adopted wire bondless BGA-based packaging methods as state-of-the-art due to the parasitic reduction offered by such 3D integration schemes, reduced cost, and reliability benefits [45][46][47][48].…”

Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar

“…Today this low-cost wafer-level eWLB packaging solution with its attractive RF performance is now used in the second generation for automotive Radar technologies of Infineon [4] [5] and is also widely spread and used by others for many automotive Radar systems for 77GHz [6]- [8]. Please refer to [9]- [12] for more details, schematics and cross-sections of the eWLB package.…”

A Study of the Intermetallic Compound Growth in Flip-Chip Packages under Thermal Loading

“…The fan-out wafer-level package input/output numbers are much higher than the wafer-level chip-scale packaging input/output numbers. The fan-out wafer-level packages [7,8] can be further developed to 2.5D/3D fan-out wafer-level packages [9,10] or fan-out package-on-package [11,12] through laser ablation or through silicon via (TSV) technology.…”