“…Fig. 2.Schematic cross-section of the two-polymer CFP technology for high-frequency application [16]. …”
Section: Two-polymer Cfp Technologymentioning
confidence: 99%
“…Fig. 3.Process flow illustration of the high-frequency CFP: (1) wafer pre-surface treatment, (2) spin coating the base polymer, curing, and cavity opening, (3) face-up PA chip embedding using a permanent glue, (4) top polymer coating, (5) via opening using lithography, (6) metallization, patterning, and antenna fabrication, and finally (7) releasing system-in-foil from the substrate [16]. …”
Section: Two-polymer Cfp Technologymentioning
confidence: 99%
“…4.Layout of the 3-Path DPA. The red blocks represent the DPA as a heater whereas four green blocks are bipolar-based temperature-sensing diode [16]. …”
Section: Thermal Characterizationmentioning
confidence: 99%
“…5.Measured surface temperature increase using four different diode locations. Δ T = T 2 − T 1 , T 2 and T 1 are the measured temperatures while PA is switched ON and OFF, respectively [16]. …”
Section: Thermal Characterizationmentioning
confidence: 99%
“…9.Demonstration of the embedded PA chip with the backside heat spreader in the CFP polymer foil. The integrated system-in-foil is released from the temporary silicon carrier and is bent over a cylinder with approximately 4 mm radius of curvature [16]. …”
A flexible and adaptive energy-efficient high-speed wireless hub is developed in polymer foil as a Hybrid System-in-Foil (HySiF) using Chip-Film Patch (CFP) technology. In this matter, the SiGe BiCMOS silicon chips (2.39 × 1.65 mm2) are thinned down to 45 μm and are embedded face-up inside a two-polymer CFP carrier. The active pads of the embedded silicon chips inside foil are extended to the surface of the foil to interconnect to the antenna on the foil. The integrated hybrid system has a signal transmission at 5–6 GHz frequency band. The overall thickness of the system is below 100 μm and its bendability is down to 4 mm radius of curvature. The designed and fabricated PA silicon chips operate at 50 mA with a 1.5 V supply voltage. Therefore, in addition to the high lateral thermal resistance of the thinned chip, self-heating loop inside polymer due to the low thermal conductivity of the embedding polymer raises the system temperature. Consequently, the thermal behavior and RF performance of the PA chip under different conditions are investigated. Moreover, the antenna with the required carrier frequency is simulated, fabricated, and measured on top of the polymer foil as a stand-alone system in the flexible CFP.
“…Fig. 2.Schematic cross-section of the two-polymer CFP technology for high-frequency application [16]. …”
Section: Two-polymer Cfp Technologymentioning
confidence: 99%
“…Fig. 3.Process flow illustration of the high-frequency CFP: (1) wafer pre-surface treatment, (2) spin coating the base polymer, curing, and cavity opening, (3) face-up PA chip embedding using a permanent glue, (4) top polymer coating, (5) via opening using lithography, (6) metallization, patterning, and antenna fabrication, and finally (7) releasing system-in-foil from the substrate [16]. …”
Section: Two-polymer Cfp Technologymentioning
confidence: 99%
“…4.Layout of the 3-Path DPA. The red blocks represent the DPA as a heater whereas four green blocks are bipolar-based temperature-sensing diode [16]. …”
Section: Thermal Characterizationmentioning
confidence: 99%
“…5.Measured surface temperature increase using four different diode locations. Δ T = T 2 − T 1 , T 2 and T 1 are the measured temperatures while PA is switched ON and OFF, respectively [16]. …”
Section: Thermal Characterizationmentioning
confidence: 99%
“…9.Demonstration of the embedded PA chip with the backside heat spreader in the CFP polymer foil. The integrated system-in-foil is released from the temporary silicon carrier and is bent over a cylinder with approximately 4 mm radius of curvature [16]. …”
A flexible and adaptive energy-efficient high-speed wireless hub is developed in polymer foil as a Hybrid System-in-Foil (HySiF) using Chip-Film Patch (CFP) technology. In this matter, the SiGe BiCMOS silicon chips (2.39 × 1.65 mm2) are thinned down to 45 μm and are embedded face-up inside a two-polymer CFP carrier. The active pads of the embedded silicon chips inside foil are extended to the surface of the foil to interconnect to the antenna on the foil. The integrated hybrid system has a signal transmission at 5–6 GHz frequency band. The overall thickness of the system is below 100 μm and its bendability is down to 4 mm radius of curvature. The designed and fabricated PA silicon chips operate at 50 mA with a 1.5 V supply voltage. Therefore, in addition to the high lateral thermal resistance of the thinned chip, self-heating loop inside polymer due to the low thermal conductivity of the embedding polymer raises the system temperature. Consequently, the thermal behavior and RF performance of the PA chip under different conditions are investigated. Moreover, the antenna with the required carrier frequency is simulated, fabricated, and measured on top of the polymer foil as a stand-alone system in the flexible CFP.
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
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