Abstract:Technologies for the embedding of active and passive components into the multilayer substrate can effectively reduce the circuit length, improve the electrical performance and thermal properties through the designing of thermal path. It allows a large extent miniaturization of products' size and makes high density packaging enabled. In this paper, we embedded the organic interposer with flip-chip into the T-shaped cavity on the core substrate to form an embedded chip package structure. First of all, the thinne… Show more
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.