EMC Oxidation Under High-Temperature Aging

Inamdar, Adwait; Gromala, Przemyslaw Jakub; Prisacaru, Alexandru; Kabakchiev, A.; Yang, Yu-Hsiang; Han, Bongtae

doi:10.1007/978-3-030-81576-9_3

Cited by 2 publications

(3 citation statements)

References 22 publications

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“…During the process of high‐temperature aging, the resin matrix on the surface of the molding compounds was oxidized to form the oxidation layer, and the oxidation layer changed the surface morphology of the aged molding compounds. [ 8 ] Figure 9b shows the weight change of the cured molding compounds during the aging process. Compared to the oxidized EMC, the oxidized MC EDB exhibits a lower weight loss.…”

Section: Resultsmentioning

confidence: 99%

“…[ 7 ] It protects the chips and interconnects against dust, moisture, chemicals, and mechanical stress from both interior and exterior environment. [ 8 ] However, a typical EMC cannot withstand a continuous operation at the temperature above 200 °C owing to its low glass transition temperature ( T g ). [ 9,10 ] Consequently, the traditional EMC is not qualified for the role as the next generation of molding compounds for WBG semiconductors.…”

Section: Introductionmentioning

confidence: 99%

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Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications

Gou

Bao

Huang

et al. 2022

Macro Materials & Eng

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Heat-resistant molding of compounds is an indispensable part in encapsulating future electronic power devices. Herein, it is used for polyfunctional epoxy resin (EP) and diamine-phenol benzoxazine (BOZ) as resin matrix, 4,4'-diaminodiphenylmethane (DDM) as curing agent, and iron acetylacetonate (Fe(acac) 3 ) as curing accelerator, as well as inorganic fillers and other auxiliaries, to prepare heat-resistant molding compounds. The curing behavior, processability and thermal performance of the EP/DDM/BOZ (EDB) resin blends containing different contents of DDM, BOZ, and Fe(acac) 3 are first systematically investigated. The EDB molding compounds (MC EDB ) with suitable BOZ content show good processability, and the molding process can be compatible with that of commercial epoxy molding compounds (EMC). With increasing the BOZ content, the glass transition temperature of cured MC EDB is greatly enhanced to a maximum of 261 °C determined by dynamic mechanical analyzer, owing to the hydrogen-bond interaction generated after polymerization of BOZ increasing the rigidity of network chains. Moreover, the cured MC EDB also exhibits higher thermal decomposition stability, better high-temperature (200 °C) mechanical properties, and lower water absorption compared to the cured EMC. After high-temperature (200 °C) aging for 500 h, the cured MC EDB with suitable BOZ content still maintains outstanding performance. This study provides a promising strategy for preparing heat-resistant electronic packaging molding compounds.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications

Gou

Bao

Huang

et al. 2022

Macro Materials & Eng

View full text Add to dashboard Cite

show abstract

“…This outer shell exhibits modified thermomechanical properties and changes the mechanical behaviour of the entire package. This can accelerate certain failure modes, such as delamination along the EMC-die interface, cracks in the bulk of EMC [7], and fatigue failure of solder joints [15]. Thus, quantifying gradual degenerative changes within EMC (here, determining the current stage of EMC oxidation) becomes crucial.…”

Section: Introductionmentioning

confidence: 99%

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Inamdar

Soestbergen

Mavinkurve

et al. 2023

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical, electrical, and chemical behaviour. High-temperature ageing of electronic packages causes the oxidation of epoxy moulding compounds (EMC), forming a layer exhibiting significantly different thermomechanical properties. This reflects in the modified mechanical behaviour of the entire package, which accelerates certain failure modes and affects component reliability. Thus, it is crucial to consider gradual degenerative changes in EMC for a more accurate estimation of the component lifetime.This paper proposes a three-step modelling approach to replicate thermo-chemical changes in package encapsulation. A parametric geometry of a test package was incorporated with the ageing stage-dependent changes in thermomechanical properties of the oxidized layer. The mechanical behaviour of oxidized EMC at multiple stages of thermal ageing (at 150 • C for up to 3000 hours) was first experimentally characterized and then validated using warpage measurements on thermally aged test packages and Finite Element (FE) simulations. Lastly, a trendbased interpolation of material model parameters for intermediate stages of ageing was followed, and a continuously updated degradation model (physics-based Digital Twin) was achieved. The proposed model is capable of reproducing degraded stages of the test package under thermal ageing along with its modified thermomechanical behaviour. Its limitations and significance in the domain of health monitoring of microelectronics are also discussed.

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EMC Oxidation Under High-Temperature Aging

Cited by 2 publications

References 22 publications

Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications

Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

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