2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023
DOI: 10.1109/icept59018.2023.10492260
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Enabling Zero Delamination between Lead Frame Surface and Epoxy Molding Compound at Zero-hour and MSL1 in Leaded Package

Wenhao Lan,
Wa-San Leung,
Zhigang Li
et al.
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