Encapsulated micro mechanical sensors

Abstract

Encapsulated micro mechanical sensors were fabricated using glass-silicon anodic bonding and an electrical feedthrough structure. Two parallel plates which can be used not only for capacitive sensors but also electrostatic actuators are adopted for integrated sensors as capacitive pressure sensors, accelerometers and resonating sensors. Micromachining technologies were developed for these packaged micro sensors. These include silicon etching technologies as laser assisted etching, deep RIE and in-process thickness monitoring during wet etching. Anodic bonding technologies which enable to incorporate a circuit inside the package and to keep a sealed cavity at a high vacuum are also developed.

Wafer-level glass-caps for advanced optical applications

“…The novel deposition and microstructuring of glass allows the formation of thin films of dense borosilicate glass on a broad range of substrates at substrate temperatures below 100 °C [3,4].…”

Surface micromachining for microelectromechanical systems

“…Several original equipment manufacturers have dedicated fabrication equipment designed to address some of these issues; however, more work needs to be done from both the technology and equipment support side to bring the next-generation packaging concepts to fruition. In the meantime, researchers have addressed this issue by using low-stress thin-film encapsulants [39], permeable thin films [40], molded and transferred polycrystalline capping structures [41], and dissolved wafer capping techniques [37], as well as conventional glasssilicon anodic bonding techniques [42], at times employing nonevaporable getter materials within the device cavity [43].…”

Microsystems by Bulk Micromachining

“…The structure is shown in Fig.1. Air bearing was used and the rotational speed of 10000 rpm was achieved [12]. Micro power generators made of SiC micro air turbine are under development using the deep RIE and the micro-reaction sintering mentioned above.…”