Encapsulation of Integrated Circuits Containing Beam Leaded Devices with a Silicone RTV Dispersion

Jaffe, D.

doi:10.1109/tphp.1976.1135126

Cited by 31 publications

(3 citation statements)

References 3 publications

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“…The HIC assembly steps include: attaching components, circuit separation, attaching external leads, encapsulating and testing. The encapsulating material is an RTV silicone rubber 13 which forms a conformal coating over the film integrated circuits and the attached devices.…”

Section: Capacitorsmentioning

confidence: 99%

Thin film technology used in Bell System telecommunication circuits

1984

Microelectronics Journal

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This paper describes the thin film technology used for telecommunication circuits in the Bell System. Vacuum depositio,n and photolithography form the basis for the film processing steps. Nitrogen doped tantalum films are used to form the very stable thin film resistors and capacitors. Laser trimming is used to obtain precision RC active filters.Line widths down to 75 pm for conductors and 50 pm for resistors are readily achieved in production. The properties of the various components used in thin film integrated circuits are described and examples of completed circuits used in transmission, station, and switching systems are shown. Some key advantages of this technology are low cost due to batch processing techniques, high packing density and high precision of passive components.

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Section: Capacitorsmentioning

confidence: 99%

Thin film technology used in Bell System telecommunication circuits

1984

Microelectronics Journal

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“…A primary focus to ensure the MEMS device operating reliability exposed to hostile environments is to use multilayer conformal coatings that exhibit complementary merits to meet the stringent requirements. Historically, reliable nonhermetic encapsulation materials are: high purity epoxies, room temperature vulcanized (RTV) silicones, fluorinated silicone based materials, fluorinated acrylics, polyurethane, Parylenes (poly para-xylyenes Types N, C, D, F), BCB and polyimides [2]- [10], []These materials can meet a broad variety of different aspects of environmental protection criteria.…”

mentioning

confidence: 99%

“…Typically, conformal coating applying methods include glob-top coating, spray coating, curtain coating, spin coating, and chemical vapor deposition (CVD). And one of the key issues for achieving high reliability with nonhermetic conformal encapsulants for microelectronic applications is pre-encapsulation cleaning [2]. Qualified pre-cleaning of the electric circuits can perform the best interfacial adhesion.…”

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confidence: 99%

Evaluation and characterization of reliable non-hermetic conformal coatings for microelectromechanical system (MEMS) device encapsulation

Pike

Wong

et al. 2000

IEEE Trans. Adv. Packag.

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The thrust of this project was to evaluate commercial conformal encapsulation candidates for low cost aerospace applications. The candidate conformal coatings evaluated in this study included silicone elastomers, epoxies, and Parylenes with bi-layer or tri-layer designs. Properties characterized in this study included mobile ion permeation and moisture ingress resistance, interfacial adhesion variation through thermal shock cycling and 85 C/85% RH aging. Surface Insulation Resistance (SIR), Triple Track Resistance (TTR) and die shear strength were used for the corresponding electrical and physical property characterizations. Parylene F displayed excellent properties for environmental protection. Silicone elastomers displayed less resistance to the harsh environment as compared to the Parylene family (N, C, D types), but it could provide advantages for low residual stress applications. The change in adhesion strength between Parylene C and silicone elastomers after exposure to thermal shock cycling or 85 C/85%RH aging for different time periods were conducted from die shear test in terms of the interfacial failure. SIR values of all the candidate materials after 1000 h exposure to 85 C/85%RH, with 100 V dc for resistance measurement, range from 1 10 8-1 10 9. Leakage current values after 1000 h exposure to 85 C/85%RH, 175 V bias, are in the range of 10 9 to 10 11 Amp. The bi-or tri-layer conformal coating combination investigated in this study showed significant promise for encapsulation of the microelectromechanical system (MEMS) devices.

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