Energy-based methodology for the fatigue-life prediction of solder materials

A new creep–fatigue life model of lead-free solder joint

“…Furthermore, Syed [11] divided the creep strain into two parts, the strain deduced by the sliding of solder matrix and that by the grain boundary sliding. Moreover, models based on energy were also reported [12,13]. Nevertheless, whether the variable in life prediction model is plastic strain range, creep strain range or energy, it did not distinguish the contribution of fatigue and creep to failure quantitatively.…”

Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests

“…A recent trend in the study of solder joint fatigue life is the use of inelastic dissipation to predict the fatigue life (Vaynman and Mckeown, 1991;Basaran and Yan, 1998). This method is based on the theory that hysteresis loops for solder materials under cyclic loading will stabilize after a few cycles.…”