2022
DOI: 10.1016/j.sse.2022.108378
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Engineering of metal-MoS2 contacts to overcome Fermi level pinning

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Cited by 9 publications
(7 citation statements)
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“…Because these two devices were fabricated by the same process on the same WS 2 nanosheet, the different conduction polarities can be attributed to the different electrode contacts, rather than the different electron density levels in the channel materials. When the Au electrodes directly contact with the monolayer TMDCs, besides the defects generated by the bombardment of the metal atoms or clusters, many gap states can even result from the interaction of metal atoms with a 2D semiconductor. , These are the main origin of the FLP effect. , , As a result, the Fermi level of WS 2 is pinned far away from the valence band at the Au/WS 2 interface, which results in a lower potential barrier for electrons than for holes and hence an n-type FET [see the energy band diagrams in the Figures f (upper) and S3a,b in the Supporting Information]. By contrast, when the electrodes are deposited on the NiTe 2 layer, the WS 2 underneath retains its intrinsic status due to the protection of the upper NiTe 2 layers, which can avoid the FLP effect at the source and drain contacts.…”
Section: Resultsmentioning
confidence: 99%
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“…Because these two devices were fabricated by the same process on the same WS 2 nanosheet, the different conduction polarities can be attributed to the different electrode contacts, rather than the different electron density levels in the channel materials. When the Au electrodes directly contact with the monolayer TMDCs, besides the defects generated by the bombardment of the metal atoms or clusters, many gap states can even result from the interaction of metal atoms with a 2D semiconductor. , These are the main origin of the FLP effect. , , As a result, the Fermi level of WS 2 is pinned far away from the valence band at the Au/WS 2 interface, which results in a lower potential barrier for electrons than for holes and hence an n-type FET [see the energy band diagrams in the Figures f (upper) and S3a,b in the Supporting Information]. By contrast, when the electrodes are deposited on the NiTe 2 layer, the WS 2 underneath retains its intrinsic status due to the protection of the upper NiTe 2 layers, which can avoid the FLP effect at the source and drain contacts.…”
Section: Resultsmentioning
confidence: 99%
“…When the Au electrodes directly contact with the monolayer TMDCs, besides the defects generated by the bombardment of the metal atoms or clusters, 33 many gap states can even result from the interaction of metal atoms with a 2D semiconductor. 42,43 These are the main origin of the FLP effect. 33,[41][42][43]56 As a result, the Fermi level of WS 2 is pinned far away from the valence band at the Au/WS 2 interface, which results in a lower potential barrier for electrons than for holes and hence an ntype FET [see the energy band diagrams in the Figures 4f (upper) and S3a,b in the Supporting Information].…”
Section: Resultsmentioning
confidence: 99%
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“…Efficient carrier injection across the contact interface requires a strong orbital overlap between the contact and channel material, a low Schottky barrier height (SBH), and narrow tunnel barriers [33,34]. For MoS 2 , the states near the conduction and valence band edges are dominated by Mo-4d states [35][36][37][38][39][40][41]. The inherent van der Waals (vW) gap present in these systems limits the orbital overlap between the topcontact metal and these states.…”
Section: Introductionmentioning
confidence: 99%