Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic components

2008

Two rectangular block-like elements as in an electronic module are positioned in a parallel-walled channel and cooled by forced convection airflow. A metal plate without holes as a barrier protrudes above the plane of the modules. It is intended to function as a cover for protecting them from mechanical or electromagnetic damage, or as a thermal control device. Per-module heat transfer coefficients in the presence of the barrier of various gaps, G, between the barrier and the channel and distance, L, between the module and the barrier were measured. In the presence of the barrier, the heat transfer coefficient at the 2nd row module is enhanced, but it is diminished at the 1st row module. Nusselt numbers are correlated as a function of Reynolds number and G/L.

Section: Introductionmentioning

confidence: 57%

“…Sparrow et al [1][2][3] reported the most common generic configuration for electronic cooling, in which an array of rectangular heat-generating modules deployed along one wall of a flat rectangular duct is cooled by forced convection airflow. In these reports, a barrier was shown to enhance the heat transfer coefficient of a module.…”

Section: Introductionmentioning

confidence: 99%

Effect of metal plate barrier without holes in forced convection of electronic equipment

2008

“…The metal plate works as the barrier or as a thermal control device. Compared with the barrier described by Sparrow et al [1][2][3], the barrier reported here is higher and the spacing between the barrier and the modules longer, so the barrier does not always enhance the heat transfer. Furthermore, in electronic equipment, various electronic components on a circuit board act as barriers that reduce each other's heat transfer capabilities.…”

Section: Introductionmentioning

confidence: 50%

“…Sparrow et al [1][2][3] reported the most common generic configuration for electronic cooling, in which an array of rectangular heat-generating modules deployed along one wall of a flat rectangular duct is cooled by forced convection airflow. In these reports, a barrier set in the flat rectangular duct, acting as a turbulence promoter, was shown to enhance the heat transfer coefficient of the module.…”

Section: Introductionmentioning

confidence: 99%

The effect of a metal plate barrier with circular holes in the forced convection of electronic equipment

2009

Two rectangular block-like elements configured as an electronic module are positioned in a parallel-walled channel and cooled by forced convection airflow. A metal plate with circular holes as a barrier protrudes above the plane of the modules, which is intended to function as a cover for protecting them from mechanical or electromagnetic damage, or as a thermal control device. The per-module heat transfer coefficients were measured in the presence of the barrier with various heights, H, and distances, L, between the module and the barrier. In the presence of the barrier with circular holes, the heat transfer coefficient for the two modules was significantly reduced. The corresponding Nusselt numbers are determined as a function of the Reynolds number and the H/L ratio.

“…Sparrow et al [2][3][4] have studied the most common generic configuration possible for electronic cooling, in which an array of rectangular heat-generating modules deployed along one wall of a flat rectangular duct is cooled by forced convection airflow. In various reports, a turbulence-promoting barrier positioned between modules was shown to enhance heat transfer of a trailing module.…”

Section: Heat Transfer-asian Research 40 (4) 2011mentioning

confidence: 99%

The effect of a metal plate barrier with holes blocking channel in the forced convection of rectangular modules

Sawai

2011

The experimental work reported here has provided an analysis of the effect of a perforated barrier, fully spanning the flow passage upstream of a pair of modules in a duct, on heat transfer and pressure drop characteristics of heated, rectangular modules that are commonly encountered in electronic equipment.The barrier has been shown to be an effective means towards providing heat transfer enhancement. Heat transfer was increased with increasing barrier hole diameter d, and decreasing barrier porosity σ and module-barrier distance L. The enhancing effect of the barrier was found to change dramatically at L/d = 3.5 and 18. Experimental data on heat transfer coefficients were correlated as a function of L/d, σ, and Reynolds number.The pressure loss coefficient of the barrier is influenced by porosity σ, and is insensitive to the other factors experimentally investigated. The average pressure loss coefficient was correlated as a function of σ.