“…The introduced buffer layers mainly can be divided in inorganic and organic compounds. Among the reported inorganic anodic buffer layers good inorganic insulators such as transparent metal oxides Pr 2 O 3 , Y 2 O 3 , Tb 4 O 7 , ZnO (Xu et al, 2001), Al 2 O 3 (Li et al, 1997;Xu et al, 2001), SiO 2 (Deng et al, 1999;Xu et al, 2001), silicon nitride Si 3 N 4 (Jiang et al, 2000;Xu et al, 2001), carbon nitride a-C:N , transition metal oxides, also V 2 O 5 , Guo et al, 2005), MoOx (You et al, 2007;Jiang et al, 2007), WO 3 , Meyer et al, 2007), CuOx, (Hu et al, 2002;Xu et al, 2001), NiO, (Chan et al, 2004;Im et al, 2007) and Ta 2 O 5 (Lu & Yokoyama, 2003), have attracted much attention due to their capability to lower the hole-injection barrier and improve the interface morphology.…”