Enhanced Cu-Cu bonding for ultrahigh-density interconnection: Co passivation bonding with non-oxidation interfaces

Qi, Xiaoyun; Yan, Han; Yuan, Xiaohui; Bai, Yufei; Suga, Tadatomo; Wang, Chenxi

doi:10.1016/j.apsusc.2024.161940

Applied Surface Science

2025

DOI: 10.1016/j.apsusc.2024.161940

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Enhanced Cu-Cu bonding for ultrahigh-density interconnection: Co passivation bonding with non-oxidation interfaces

Xiaoyun Qi,

Han Yan,

Xiaohui Yuan

et al.

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Enhanced Cu-Cu bonding for ultrahigh-density interconnection: Co passivation bonding with non-oxidation interfaces

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References 34 publications

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