Enhanced electrical conductivity and reliability for flexible copper thin-film electrode by introducing aluminum buffer layer

Yin, Siliang; Zhu, Wei; Deng, Yuan; Peng, Yuncheng; Shen, Shengfei; Tu, Yubin

doi:10.1016/j.matdes.2016.12.043

Cited by 28 publications

(13 citation statements)

References 23 publications

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“…The oxidation of gallium is also an inducement of the phenomenon. However, the equivalent electrical resistivity of the enhanced wire mesh still shows superiority compared with most of the conductive polymers used in soft robotics . These results revealed the possibility for the enhanced material applied on soft electrode and soft conductive part.…”

Section: Performance Of the Enhanced Meshmentioning

confidence: 90%

Liquid‐Metal‐Enhanced Wire Mesh as a Stiffness Variable Material for Making Soft Robotics

et al. 2019

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Stiffness variable materials are of great interests to many fields, especially in soft robotics. However, most materials require external voltage or high temperature to trigger the stiffness regulation process, which limits their applications in many situations, such as underwater. Herein, an easyoperating low-melting-point-metal enhancer is proposed, which can discretionarily regulate the stiffness of copper (Cu) wire mesh and greatly improve the performances of the target network-organized material. The mechanical property is improved through swift stiffness variations in a large scale, from completely soft to high hardness. Over the experiments, such liquid-metal enhancer can also work as a "glue," meaning it can glue several individual meshes together in arbitrary shapes just by organizing them in proper positions. The bonding force produced by the enhancer permits a four-layer mesh combination (0.8 mm thickness) to successfully afford a load of 2 kg. In addition, the electrical resistance of the copper wire mesh decreases 10% after treated by the enhancer. Based on the results, the grabber and support structure are designed and built by the enhanced meshes and achieving the designed function. This study opens up a brand new method for fast fabrication of reconfigurable modular soft robotics that can tolerate large external forces.

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Section: Performance Of the Enhanced Meshmentioning

confidence: 90%

Liquid‐Metal‐Enhanced Wire Mesh as a Stiffness Variable Material for Making Soft Robotics

et al. 2019

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“…And also this practice enhances the temperature uniformity. Yin et al [14] made a flexible electrical electrode, they made is with the help of facile thermal evaporation, bilayer is made with CU and Al was made with this technique whose resistivity has been greatly decreased to 3.05 μΩ•cm. The introduction of Al buffer layer gave a complete growth crystalline of Cu with decreased residual thermal stress and achieved a very great flexibility.…”

Section: Literature Reviewmentioning

confidence: 99%

A Review on Porous EDM Electrodes

Sharma¹

2018

J Appl Mech Eng

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In the past years many researchers have done various advancements in material removal rate, wear of electrode is improved and various researches had done on physical and electrical parameters of EDM machine. This new research contributes the similar objectives to enhance the material removal rate and to increase the life of electrode by reducing the wear rate of electrode. So this paper review the past research work done on porous electrodes to improve the life of electrode and to reduce the lift up time of electrode to flush debris and various work on porous electrodes to reduce lift up time.

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“…The experimental results show that bending property of our electrode obviously precede the previous reported Cu electrodes deposited on polyimide substrates by thermal evaporation, whose electrical resistivity change was more than 2.2 times. [6] To further verify the thermal durability of the flexible Cu film, we also measured the electrical resistivity change of the flexible film during the thermal fatigue shock test with a temperature range of −40-110 °C (Figure 9b). Similarly, the electrical resistivity is almost unchanged after 550 thermal shock tests, revealing that the flexible Cu film electrode here has a strong capacity to tolerate extreme temperature variation.…”

Section: Reliability Of the Cu Film Electrodementioning

confidence: 99%

“…[4] Metal thin films fabricated by physical vacuum deposition (PVD) are dominant in the electronics due to the easy fabrication and patterning, high electrical performance, and robust mechanical property of the films. [5,6] To meet the desired needs of flexible electronics, novel flexible conductive polymers (such as, especially, poly(3,4-ethylene dioxythiophene):(styrene sulfonate) [7][8][9] and polystyrensulfonate, [10] ) have aroused wide attention. Meanwhile, metal paste (binder mixed with Ag nanoarrays, [11] Au nanoparticles, high-quality thin films fabricated in harsh conditions.…”

Section: Introductionmentioning

confidence: 99%

Highly Conductive and Fatigue‐Free Flexible Copper Film Electrode Fabricated by a Facile Dry Transfer Technique

Shen

Zhu

Peng

et al. 2017

Adv Materials Inter

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also intensively investigated through techniques of spincoating, [15] screen printing, [16] and inkjet printing.[17] Besides, new novel printing inks that consist of low dimension metallic nanomaterials, such as Cu nanowires, [18,19] Ag nanowires, [20,21] and Au nanowires [22] have been widely explored. Although the emerging techniques have greatly boomed the application of the flexible electrode, inevitable organic solvents in the preparation process will bring on high porosity and weak adhesion of the prepared flexible thin film. [23] These demerits seriously limit the electrical conductivity and durability of the thin-film electrode, so in short-term future, PVD technology is still the best candidate to fabricate high-performance thin-film electrodes.Currently, there are mainly two key aspects restricting the popularity of metal thin film deposited on flexible substrates through PVD method. One is the weak adhesion strength of the interface between the metal thin film and flexible polymer substrates caused by the huge isomerism of materials. [24] On the other hand, owing to the poor heat resistance and unstable chemical properties of the polymer substrates, the deposition temperature is confined to a relatively low range, which is adverse to the crystallization of metal particles as well as the electrical performance. [25] The adhesive strength of the metalpolymer substrates can be improved by inserting a buffer interlayer, [26] varying the roughness of the interface, [27] and O 2 plasma treatment. [28] Nevertheless, it is still challenging to prepare high-performance metal films on flexible substrate even though the films deposited at low temperature could be slightly improved via postannealing process.Transfer printing is a unique approach that can be applied to integrate materials fabricated under harsh conditions onto plastic substrates. [29] In the transfer process, the essential issue is the detachment of rigid donor-film interface, which can be realized through etching the sacrificial layers, [30] functionalizing the donor surfaces with adhesion reduction layers, and stress-inducing delamination. [31] However, it is inevitable to corrode the transfer layer when the integration of donor-thin film system is immersed in the etching solutions. Functionalizing the donor surfaces with adhesion reduction layers cannot resist to high temperature process, for the coating material is organic. [32] As there is no heterogeneous material access in the transfer process, the method of stress inducing delamination is simple, nondestructive, and compatible with high temperature techniques, which is rather suitable for the transfer of The flexible electrodes with excellent electrical and mechanical performance play critical and fundamental roles in the wearable electronics. In this work, highly conductive and fatigue-free flexible copper thin-film electrodes on polyethylene terephthalate substrate are successfully fabricated by a facile, nondestructive, and heat-resistant dry transfer technique. Before the transfer proc...

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Enhanced electrical conductivity and reliability for flexible copper thin-film electrode by introducing aluminum buffer layer

Cited by 28 publications

References 23 publications

Liquid‐Metal‐Enhanced Wire Mesh as a Stiffness Variable Material for Making Soft Robotics

Liquid‐Metal‐Enhanced Wire Mesh as a Stiffness Variable Material for Making Soft Robotics

A Review on Porous EDM Electrodes

Highly Conductive and Fatigue‐Free Flexible Copper Film Electrode Fabricated by a Facile Dry Transfer Technique

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