Enhanced Interfacial Bonding and Mechanical Properties of Graphene/Cu Composites: A Matrix-Alloying Method

Wang, Fan; Chu, Ke; Li, Yubiao; Wang, Xiaohu

doi:10.1002/pssa.201800104

Cited by 3 publications

(2 citation statements)

References 40 publications

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“…The main problem for the development of MMNCs is the accomplishment for the homogeneous dispersion, the attainment of high strength interfacial bonding and the retention of structural stability. 162,163 The harsh processing conditions do affect the structural integrity of carbonaceous material which in turn results in the chemical reaction between the materials to occur readily. In practice, care must be taken in the manufacturing of metal matrix composites i.e.…”

Section: Processing Techniquesmentioning

confidence: 99%

Graphene-based metal matrix nanocomposites: Recent development and challenges

Ranjan

Bajpai

2021

Journal of Composite Materials

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This articles reviews till-date available literature on metal matrix composites reinforced with graphene, CNT and other carbonaceous materials. The article has a special focus on the mechanical, tribological and challenges associated with the fabrication of nanocomposites. Simultaneously, it reviews the synthesis, strengthening mechanism and applications of graphene along with research gap associated with graphene metal matrix nanocomposites (GMMNC). Carbonaceous nanofillers, e.g. Graphene, are known to have extraordinary mechanical, thermal and electrical properties along with multifaceted characteristics. These materials have the potential to become an ideal material in numerous application which requires reinforcement. Graphene nanoplatelets (GNP) suffers various challenges starting from its synthesis to the uniform distribution within the matrix material. Our concern is to give details on the challenges associated with graphene and metal matrix composites along with the solution so that new research can be done at its ease. Section 1 of the article gives a detailed analysis of various carbonaceous reinforcement materials. Preparation, processing and dispersion technique for graphene and composite material is given in section 2. Section 3 of the article deals with different matrix material used in MMNC along with the properties and challenges associated with it in tabulated form. Strengthening mechanism used for the enhancement of mechanical properties of composites is described in section 4, whereas, Section 5 deals with the applications and Research gap.

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Section: Processing Techniquesmentioning

confidence: 99%

Graphene-based metal matrix nanocomposites: Recent development and challenges

Ranjan

Bajpai

2021

Journal of Composite Materials

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“…The interfacial bonding strength is hard to measure directly, due to its small scale in the composite materials. Many related research works combine mechanical properties and fractography around the reinforcement of the composites to assess the interfacial bonding [100][101][102]. For example, Wu et al derive an equation to evaluate the interfacial bonding energy theoretically [103], which is expressed as: c ¼…”

Section: Thermal Boundary Conductancementioning

confidence: 99%

High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.

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