Enhanced Luminance of Blue Light‐Emitting Polymers by Blending with Hole‐Transporting Materials

Abstract

[5] Decreasing the temperature, two regimes are successively observed: i) a one-dimensional regime where the physics of the electron gas presents a lack of quasi-particle states at the Fermi energy accompanied by the existence of separate collective modes for spin and charge degrees of freedom: a) J. Voit, Rep. Prog. Phys. 1995, 58, 977; and ii) a temperature domain where interchain couplings become relevant leading to long range ordered phases: b) T. Lorenz, M. Hofmann, M. Grüninger, A. Freimuth, G. S. Uhrig, M. Dumm, M.

Aryltriazene photopolymer thin films as sacrificial release layers for laser-assisted forward transfer systems: study of photoablative decomposition and transfer behavior

“…The use of thin intermediate films of metals (e.g., Ag, Au, Ti) or metal oxides (e.g., TiO 2 ) has been reported as absorbing layers for UV laser-based forward transfer applications of biomolecules [18][19][20][21] and cells [12,22], in the literature referred to as absorbing film assisted (AFA) LIFT [23][24][25] and Biological Laser Printing (BioLP TM ) [12,26]. Various polymeric composite materials (usually a binder matrix doped with dispersed absorber dyes) have been applied as DRL systems mostly in conjunction with powerful IR lasers, e.g., for highresolution full-color printing [27][28][29] and the microdeposition of electronic materials [30][31][32][33][34]. However, such intermediate absorbing light-to-heat conversion layers could not completely reduce the intrinsically high thermal load on sensitive transfer materials during the thermo-propulsive transfer process [31][32][33][34].…”

“…Various polymeric composite materials (usually a binder matrix doped with dispersed absorber dyes) have been applied as DRL systems mostly in conjunction with powerful IR lasers, e.g., for highresolution full-color printing [27][28][29] and the microdeposition of electronic materials [30][31][32][33][34]. However, such intermediate absorbing light-to-heat conversion layers could not completely reduce the intrinsically high thermal load on sensitive transfer materials during the thermo-propulsive transfer process [31][32][33][34]. For all these DRL-based LIFT systems, it is important that the decomposition products of such additional intermediate sacrificial absorbing layers will not contaminate the transferred layer, as, e.g., observed for metal absorbing film-assisted (AFA) LIFT methods [25].…”

Thermal buffer materials for enhancement of device performance of organic light emitting diodes fabricated by laser imaging process

“…Nevertheless, as photolithography process requires the use of wet etchant, developer, stripper, etc., all of which can damage organic layers, there has been no other option except for using such thermal evaporation-based technology [6][7][8][9][10][11][12][13][14]. In the meanwhile, the Laser Induced Thermal Imaging (LITI) process has been developed to become the most promising alternative for OLED fabrication, because it yields a much higher process accuracy (about ±3 lm) and provides the possibility of large-area processing applicable to active matrix OLED fabrication [15].…”

Unconventional, Laser Based OLED Material Direct Patterning and Transfer Methods

“…This dynamic release layer is the crucial part of the LIFT process and can be (a) a part of material of interest, (b) specially designed light absorbing thin intermediate layers in LITI (laser induced thermal imaging) (Lamansky et al 2005, Blanchet et al 2003a, Suh et al 2003 and LIPS (laser 197 induced pattern-wise sublimation) process (Hirano et al 2007) or (c) a mixture of active or sensitive material in a UV absorbent matrix in MAPLE DW(matrix assisted pulsed laser evaporation direct writing) (Piqué et al 1999, Arnold et al 2007 process. LIFT and several variations have demonstrated deposition of metals, metal oxide films, inorganic dielectric films, ceramics, and polymer and biomaterials.…”

“…OLED display manufacturing employs direct write techniques for patterning the various materials. Examples of OLED material direct write technologies include ink jet printing (Hashimoto et al, 2006, Gohda et al 2002, Lee et al 2002,, Kobayshi et al 2002, Shirasaki et al 2004, Fleuster et al 2004, Lee et al 2005, Saafir et al 2005) screen printing (Shinar et al 2007, Lee et al 2009) and laser induced forward transfer (LIFT) (Hirano et al 2007, Piqué et al 1999, Suh et al 2003, Willis et al 2005, Kyrkis et al 2006. As described in a recent review on OLED RGB patterning, success of an OLED patterning scheme depends on the material type, device design, pixel array pattern, display format, substrate size, placement accuracy, process TACT-time, and defect density.…”